Cite
Mechanical design and analysis of direct-plated-copper aluminum nitride substrates for enhancing thermal reliability.
MLA
Tsai, M. Y., et al. “Mechanical Design and Analysis of Direct-Plated-Copper Aluminum Nitride Substrates for Enhancing Thermal Reliability.” Microelectronics Reliability, vol. 55, no. 12, Dec. 2015, pp. 2589–95. EBSCOhost, https://doi.org/10.1016/j.microrel.2015.08.010.
APA
Tsai, M. Y., Huang, P. S., Lin, C. H., Wu, C. T., & Hu, S. C. (2015). Mechanical design and analysis of direct-plated-copper aluminum nitride substrates for enhancing thermal reliability. Microelectronics Reliability, 55(12), 2589–2595. https://doi.org/10.1016/j.microrel.2015.08.010
Chicago
Tsai, M.Y., P.S. Huang, C.H. Lin, C.T. Wu, and S.C. Hu. 2015. “Mechanical Design and Analysis of Direct-Plated-Copper Aluminum Nitride Substrates for Enhancing Thermal Reliability.” Microelectronics Reliability 55 (12): 2589–95. doi:10.1016/j.microrel.2015.08.010.