Cite
Impact of thermal annealing on Ge-on-Insulator substrate fabricated by wafer bonding.
MLA
Kang, J., et al. “Impact of Thermal Annealing on Ge-on-Insulator Substrate Fabricated by Wafer Bonding.” Materials Science in Semiconductor Processing, vol. 42, Feb. 2016, pp. 259–63. EBSCOhost, https://doi.org/10.1016/j.mssp.2015.07.021.
APA
Kang, J., Yu, X., Takenaka, M., & Takagi, S. (2016). Impact of thermal annealing on Ge-on-Insulator substrate fabricated by wafer bonding. Materials Science in Semiconductor Processing, 42, 259–263. https://doi.org/10.1016/j.mssp.2015.07.021
Chicago
Kang, J., X. Yu, M. Takenaka, and S. Takagi. 2016. “Impact of Thermal Annealing on Ge-on-Insulator Substrate Fabricated by Wafer Bonding.” Materials Science in Semiconductor Processing 42 (February): 259–63. doi:10.1016/j.mssp.2015.07.021.