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Robust design of thermo-mechanical MEMS switch embedded in aluminium BEOL interconnect.

Authors :
Orellana, S.
Arrazat, B.
Fornara, P.
Rivero, C.
Blayac, S.
Montmitonnet, P.
Inal, K.
Source :
Microelectronics Reliability. Aug2015, Vol. 55 Issue 9/10, p1896-1900. 5p.
Publication Year :
2015

Abstract

A new concept of a thermo-mechanical lateral switch activation is proposed. Embedded in standard aluminium BEOL (Back End Of Line), it is fully integrated in CMOS technology. The simplicity of this low cost one-mask fabrication allows the straightforward scalability of design. Most functional problems have been solved through process, simulation and design: stiction, bending, displacement, and robustness. The present study of a thermo-mechanical MEMS switch focuses on three points. Firstly, the design is modified to increase the apparent area contact and the force applied. Secondly, in order to ensure the reversibility of the movement, a running-in step before operation is implemented. Finally, a new design is proposed, simulated and manufactured to avoid the undesirable activations by spurious homogeneous heating. [ABSTRACT FROM AUTHOR]

Details

Language :
English
ISSN :
00262714
Volume :
55
Issue :
9/10
Database :
Academic Search Index
Journal :
Microelectronics Reliability
Publication Type :
Academic Journal
Accession number :
110216234
Full Text :
https://doi.org/10.1016/j.microrel.2015.06.032