Failure mechanism study and immunity modeling of an embedded analog-to-digital converter based on immunity measurements.

In this paper, the failure mechanism of an embedded analog-to-digital converter (ADC) is studied and its immunity modeling with regard to electromagnetic interferences is presented. Failure causes are identified based on off-chip immunity measurements and without specific knowledge of the ADC's design. Disturbances coupling paths inside the ADC have been recognized as well as the conversion error mechanism. Then, immunity of the ADC is modeled using the ICIM-CI (Integrated Circuit Immunity Model for Conducted Immunity) black-box modeling approach. We show the interest of using the direct power injection (DPI) measurement technique for both analyzing and modeling the immunity of complex integrated circuits. [ABSTRACT FROM AUTHOR]