Back to Search Start Over

Silicon Nanowire Arrays Based On-Chip Thermoelectric Generators.

Authors :
Lee, Kam Yu
Brown, David
Kumar, Satish
Source :
IEEE Transactions on Components, Packaging & Manufacturing Technology. Aug2015, Vol. 5 Issue 8, p1100-1107. 8p.
Publication Year :
2015

Abstract

Thermoelectric generators (TEGs) can improve the net power consumption of electronic packages by generating power from the chip waste heat. In this paper, a 3-D computational model of electronic package with silicon nanowire (Si-NW)-based embedded TEGs has been developed and the effect of crucial geometric parameters, contact resistances, and thermal properties, such as pitch length and length of Si-NWs, the electrical contact resistivity at Si-NW interface, thermal contact resistivity at TEG-package interface, and filling material thermal conductivity on power generation, has been evaluated. The analysis has shown how modifying some crucial parameters from their current values in different experimental studies affect power generation, e.g., decreasing the pitch length from 400 to 200 nm doubled the power generation, increasing the Si-NW length from 1 to 8 \mu \textm increased power generation by a factor of three and decreasing contact resistivity by one order of magnitude from 1.0\times 10^-11\Omega \,\cdot \,\textm^2 enhanced the power generation by a factor of two. This paper has estimated the energy conversion efficiency of 0.15% for 8- \mu \textm long Si-NWs using the best thermoelectric properties available from different experimental studies. Finally, performance of Si-NW-based TEG has been compared against the Bi2Te3 superlattice-based TEGs and the crucial parameters of Si-NW TEGs have been identified which should be the focus of the future studies. [ABSTRACT FROM AUTHOR]

Details

Language :
English
ISSN :
21563950
Volume :
5
Issue :
8
Database :
Academic Search Index
Journal :
IEEE Transactions on Components, Packaging & Manufacturing Technology
Publication Type :
Academic Journal
Accession number :
108971014
Full Text :
https://doi.org/10.1109/TCPMT.2015.2450234