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Effects of UV curing on the self-forming barrier process of Cu–V alloy films.
- Source :
-
Surface & Coatings Technology . Aug2015, Vol. 276, p254-259. 6p. - Publication Year :
- 2015
-
Abstract
- In our previous studies, vanadium (V)-based self-formed barriers were found at the interface between Cu–V alloy films and low-k/Si substrates after annealing at elevated temperatures. In the present work, the diffusion barrier properties of the V-based self-formed interlayer on low-k dielectrics were investigated with and without UV curing treatment. A V-based interlayer on a low-k substrate with UV curing exhibited lower electrical resistivity and higher thermal stability than on a low-k substrate without UV curing. Transmission electron microscopy (TEM) images and energy-dispersive X-ray spectroscopy (EDS) showed that an approximately 4-nm V-based interlayer was found only on the low-k substrates with UV curing after annealing at 300 °C for 1 h. Based on these results, UV curing may play an important role in the formation of a V-based interlayer due to changes in the chemical composition and porosity of the dielectric layer. [ABSTRACT FROM AUTHOR]
Details
- Language :
- English
- ISSN :
- 02578972
- Volume :
- 276
- Database :
- Academic Search Index
- Journal :
- Surface & Coatings Technology
- Publication Type :
- Academic Journal
- Accession number :
- 108823617
- Full Text :
- https://doi.org/10.1016/j.surfcoat.2015.06.049