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New insights into the change of voltage acceleration and temperature activation of oxide breakdown

Authors :
Ribes, G.
Bruyère, S.
Monsieur, F.
Roy, D.
Huard, V.
Source :
Microelectronics Reliability. Aug2003, Vol. 43 Issue 8, p1211. 4p.
Publication Year :
2003

Abstract

A large database of time-dependent dielectric breakdown study was conducted on 50 A˚ SiO2 film over a wide range of temperature (125–300 °C) and a large range of voltage stress (−4.4 to −6.8 V). Using an accurate methodology, we suppress any correlation between voltage and temperature dependence of the voltage acceleration factor and the activation energy. A possible origin of the non-Arrhenius temperature dependence is discussed and a valid window for E-model lifetime prediction is defined. This study shows the high temperature impact on the reliability projection and point at the difficulty to predict the time-to-breakdown using activation energy as an extrapolation parameter. [Copyright &y& Elsevier]

Subjects

Subjects :
*DIELECTRICS
*BREAKDOWN voltage

Details

Language :
English
ISSN :
00262714
Volume :
43
Issue :
8
Database :
Academic Search Index
Journal :
Microelectronics Reliability
Publication Type :
Academic Journal
Accession number :
10364647
Full Text :
https://doi.org/10.1016/S0026-2714(03)00174-4