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Fabrication and Characterization of a Vacuum Encapsulated Curved Beam Switch for Harsh Environment Application.

Authors :
Bo Woon Soon
Ng, Eldwin J.
Hong, Vu A.
Yushi Yang
Chae Hyuck Ahn
You Qian
Kenny, Thomas W.
Chengkuo Lee
Source :
Journal of Microelectromechanical Systems. Oct2014, Vol. 23 Issue 5, p1121-1130. 10p.
Publication Year :
2014

Abstract

A vacuum-encapsulated silicon switch with a curved electrode is characterized for operation in harsh environments. An ultraclean vacuum encapsulation process (episeal) seals the switch after release, providing a pristine operating environment for switching operations. In these devices, the curved beam of the actuator enhances the overdrive voltage tolerance to be more than 100 V. The ON/OFF cycle tests were carried out up to 105 cycles at room temperature, and at least 104 cycles under an elevated temperature of 300°C. Throughout the 300°C tests, an average contact resistance of ~ 28 kΩ is measured, demonstrating the stability of the contact. Finally, high speed pulse I-V monitoring unit was used to observe 13-μs switching speed. [ABSTRACT FROM AUTHOR]

Details

Language :
English
ISSN :
10577157
Volume :
23
Issue :
5
Database :
Academic Search Index
Journal :
Journal of Microelectromechanical Systems
Publication Type :
Academic Journal
Accession number :
101290611
Full Text :
https://doi.org/10.1109/JMEMS.2014.2305754