Cite
Optimization of process conditions for the transfer molding of electronic packages
MLA
Tong, K. W., et al. “Optimization of Process Conditions for the Transfer Molding of Electronic Packages.” Journal of Materials Processing Technology, vol. 138, no. 1–3, July 2003, p. 361. EBSCOhost, https://doi.org/10.1016/S0924-0136(03)00099-2.
APA
Tong, K. W., Kwong, C. K., & Ip, K. W. (2003). Optimization of process conditions for the transfer molding of electronic packages. Journal of Materials Processing Technology, 138(1–3), 361. https://doi.org/10.1016/S0924-0136(03)00099-2
Chicago
Tong, K.W., C.K. Kwong, and K.W. Ip. 2003. “Optimization of Process Conditions for the Transfer Molding of Electronic Packages.” Journal of Materials Processing Technology 138 (1–3): 361. doi:10.1016/S0924-0136(03)00099-2.