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Influence of titanium dioxide nanopowder addition on microstructural development and hardness of tin–lead solder
- Source :
-
Materials Letters . Jul2003, Vol. 57 Issue 21, p3193. 6p. - Publication Year :
- 2003
-
Abstract
- This paper presents the microstructure and hardness of composite solders obtained by the addition of nanopowders of titanium dioxide to a conventional solder. Titanium dioxide powders-reinforced lead (Pb)–tin (Sn) composite solders were prepared by thoroughly blending nano-sized titanium dioxide powders with powders of a eutectic solder and using a water-soluble flux. The blended solder paste was melted and allowed to re-solidify in a crucible placed on a hot plate and maintained at a constant temperature. Optical microscopy observations revealed that for additions of titanium dioxide up to 1 wt.%, the grain size and width of the grain boundary decreased. For the addition of 2 wt.% of titanium dioxide, nanopowders microporosity was observed both at and along the grain boundary regions coupled with the presence of second-phase particles. Microhardness measurements revealed that the addition of titanium dioxide nanopowders is helpful in enhancing the overall strength of the eutectic solder. [Copyright &y& Elsevier]
- Subjects :
- *SOLDER & soldering
*TITANIUM dioxide
Subjects
Details
- Language :
- English
- ISSN :
- 0167577X
- Volume :
- 57
- Issue :
- 21
- Database :
- Academic Search Index
- Journal :
- Materials Letters
- Publication Type :
- Academic Journal
- Accession number :
- 10060978
- Full Text :
- https://doi.org/10.1016/S0167-577X(03)00023-5