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With the increasing integration density of semiconductor devices and the ongoing development of advanced manufacturing processes, higher demands have been placed on semiconductor etching processes.The inner walls of etch chambers, when exposed to high-density plasma bombardment, may release particulate contaminants, causing process shift.In severe cases, the resultant contaminants may result in current short circuit and a decline in production yield.The application of plasma etching resistant coatings on the inner surfaces of etching chambers has proven effective in reducing plasma-induced corrosion and minimizing particulate contamination.The proper selection of coating material and preparation techniques can markedly enhance the plasma resistance of etching chamber components and extend their service lifespan.This article summarized the current research on plasma etching resistant coatings, examining the relationship between plasma etching conditions and the erosion behavior of coatings.It reviewed the research progress on various materials, including Al2O3,Y2O3,YAG,YF3,YOF and amorphous glass.Additionally, the characteristics of coating preparation techniques and the influence of microstructure on plasma etching performance were explored.Finally, the requirements and selection criteria for plasma etching resistant coatings were discussed.  [ABSTRACT FROM AUTHOR]

In this paper, the acceleration process of BaTiO3 ceramic particles under different vacuum cold spraying parameters was simulated, and the effect of process parameters on particle velocity was discussed. The results were verified using particle image velocimeter. BaTiO3 ceramic coatings were prepared using vacuum cold spraying method and their properties were tested. The simulation results showed that the particle velocity increased with the increase of gas pressure and preheating temperature. It was observed that under the same gas pressure and preheating temperature, the smaller the diameter of the particle, the more it was affected by the bow shock wave. The acceleration pattern of multiple particles was found to be similar to that of a single particle. According to the results obtained from particle image velocimetry, under the condition of and 300 K and 373 K at 0.2 MPa, the velocity of BaTiO3 particles differed from the simulation results by about 10.2% and 8.1%, respectively. Under the process parameters, as indicated by the simulation results, the continuous and dense BaTiO3 coatings with a thickness around 2 to 3 μm were fabricated by vacuum cold spraying, and the binding force was found to be 8 N. The research results indicated that the process parameters and their influence laws, obtained through numerical simulation combined with particle image velocimetry, were reliable and could be used to guide the preparation of flexible ceramic films.

In order to avoid the deterioration of the electrical properties of the lead zirconate titanate (PZT) coating due to the poor bonding performance between the PZT coating and the metal substrate, an Al2O3 layer is introduced as a transition layer between the PZT coating and the metal substrate. It is found that the failure of the PZT/Al2O3 structure depends on the size of the transition layer. Scanning electron microscope (SEM) results show that as the transition layer thickness increases beyond 90 μm, cracks appear in the coating, and the crack direction is perpendicular to the PZT/Al2O3 interface. With the increase in thickness, in addition to the cracks perpendicular to the PZT/Al2O3 interface, cracks parallel to the interface also appeared in the coating. X-ray diffraction (XRD) results show that the PZT coating samples have a typical perovskite structure, and their crystallinity is negatively correlated with Al2O3 thickness. With the increase of the transition layer thickness, the electrical properties of PZT/Al2O3 gradually decrease. Piezoelectric force microscope (PFM) results show that the amplitude response decreases with increasing Al2O3 thickness. When the Al2O3 thickness is 110 μm, the energy loss during the polarization process is the most significant. The residual stress results show that different sizes of Al2O3 transition layers provide different initial stress conditions for the PZT/Al2O3 structure. The initial compressive residual stress increases with increasing Al2O3 layer thickness. It changes the stress distribution at the interface and provides a driving force for crack growth, and the structural integrity of the PZT coating is damaged. The phase results show that the domain size of the PZT coating increases with the increase of the Al2O3 layer size, which may be due to the peeling between PZT and Al2O3, which makes the PZT layer not completely constrained by the matrix, and the domain size of the PZT coating increases. [ABSTRACT FROM AUTHOR]