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Additive manufacturing (AM) excels in engineering intricate shapes, pioneering functional components, and lightweight structures. Nevertheless, components fabricated through AM often manifest elevated residual stresses and a myriad of thermally induced micro-instabilities, including cracking, incomplete fusion, crazing, porosity, spheroidization, and inclusions. In response, this study proposed a sophisticated multi-sensing inspection system specifically tailored for the inspection of thermally induced micro-instabilities at the micro–nano scale. Simulation results substantiate that the modulation transfer function (MTF) values for each field of view in both visible and infrared optical channels surpass the benchmark of 0.3, ensuring imaging fidelity conducive to meticulous examination. Furthermore, the innovative system can discern and accurately capture data pertaining to thermally induced micro-instabilities across visible and infrared spectra, seamlessly integrating this information into a backend image processing system within operational parameters of a 380–450 mm distance and a 20–70 °C temperature range. Notably, the system's design is harmoniously aligned with the requisites of processing and assembly, heralding a significant advancement in bolstering the inspection effect of thermally induced micro-instabilities for the AM component. [ABSTRACT FROM AUTHOR]

Additive manufacturing (AM) excels in engineering intricate shapes, pioneering functional components, and lightweight structures. Nevertheless, components fabricated through AM often manifest elevated residual stresses and a myriad of thermally induced micro-instabilities, including cracking, incomplete fusion, crazing, porosity, spheroidization, and inclusions. In response, this study proposed a sophisticated multi-sensing inspection system specifically tailored for the inspection of thermally induced micro-instabilities at the micro–nano scale. Simulation results substantiate that the modulation transfer function (MTF) values for each field of view in both visible and infrared optical channels surpass the benchmark of 0.3, ensuring imaging fidelity conducive to meticulous examination. Furthermore, the innovative system can discern and accurately capture data pertaining to thermally induced micro-instabilities across visible and infrared spectra, seamlessly integrating this information into a backend image processing system within operational parameters of a 380–450 mm distance and a 20–70 °C temperature range. Notably, the system’s design is harmoniously aligned with the requisites of processing and assembly, heralding a significant advancement in bolstering the inspection effect of thermally induced micro-instabilities for the AM component.