1. On the form of high-frequency voltage-capacitance characteristics of metal-insulator-semiconductor structures with a ferroelectric insulating layer BaxSr1-хTiO3.
- Author
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Goldman, Evgeny I., Chucheva, Galina V., and Belorusov, Dmitry A.
- Subjects
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ELECTRIC capacity , *ELECTRIC potential , *ELECTRON traps , *FERROELECTRIC thin films , *CAPACITANCE measurement , *CHARGE carriers - Abstract
A model of the high-frequency impedance of metal-ferroelectric-semiconductor structures has been composed and analyzed. An algorithm is formulated for recovering the impedance of the potential drop across the ferroelectric layer, band bending in a semiconductor, the total concentration of charged boundary states and minority charge carriers on the semiconductor surface from the experimental field characteristics as a function of the voltage across the structure. The results of high-frequency measurements of the capacitance and conductivity of Ni–Ba 0.8 Sr 0.2 TiO 3 –Pt and Ni–Ba 0.8 Sr 0.2 TiO 3 –Si structures in the paraelectric phase are presented. It is shown that Si does not evolve into a state of strong depletion in the entire range of external voltages, and the capacitances of the semiconductor and the metal-ferroelectric-silicon structures practically coincide. This is due to the almost complete screening of the ferroelectric layer polarization by the charges of electron traps at the Ba 0.8 Sr 0.2 TiO 3 –Si contact. It is proposed to use dangling bond passivation methods realized in planar silicon technology to reduce the concentration of active trapping centers at the ferroelectric-semiconductor interface. [ABSTRACT FROM AUTHOR]
- Published
- 2021
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