1. Tuning Wireless Intra-Chip Channels with Programmable Metasurfaces
- Author
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Mohammadreza F. Imani, Sergi Abadal, Philipp del Hougne, Arizona State University [Tempe] (ASU), Universitat Politècnica de Catalunya [Barcelona] (UPC), Institut d'Électronique et des Technologies du numéRique (IETR), Université de Nantes (UN)-Université de Rennes 1 (UR1), Université de Rennes (UNIV-RENNES)-Université de Rennes (UNIV-RENNES)-Institut National des Sciences Appliquées - Rennes (INSA Rennes), Institut National des Sciences Appliquées (INSA)-Université de Rennes (UNIV-RENNES)-Institut National des Sciences Appliquées (INSA)-CentraleSupélec-Centre National de la Recherche Scientifique (CNRS), Université de Nantes (UN)-Université de Rennes (UR)-Institut National des Sciences Appliquées - Rennes (INSA Rennes), Institut National des Sciences Appliquées (INSA)-Institut National des Sciences Appliquées (INSA)-CentraleSupélec-Centre National de la Recherche Scientifique (CNRS), and Nantes Université (NU)-Université de Rennes 1 (UR1)
- Subjects
Impulse response ,Computer science ,Multi-path effect ,Chip packages ,02 engineering and technology ,Tuning ,01 natural sciences ,Bottleneck ,010309 optics ,[SPI]Engineering Sciences [physics] ,Radio frequency links ,Interference (communication) ,On chips ,0103 physical sciences ,0202 electrical engineering, electronic engineering, information engineering ,Electronic engineering ,Wireless ,Multicore chips ,Multi-core processor ,Propagation environment ,business.industry ,Metasurface ,Metamaterial ,020206 networking & telecommunications ,Chip ,Computational performance ,Inter-symbol interferences ,Wireless radio-frequency ,Radio frequency ,business ,Multipath propagation - Abstract
International audience; Communication on multi-core chips is a severe bottleneck for computational performance. A potential solution, wireless radiofrequency links between far apart cores, suffers from strong multipath effects within the chip package that cause inter-symbol interference. We propose to empower the on-chip propagation environment with in situ programmability by equipping it with a programmable metasurface. By locally tuning the boundary conditions of the metallic enclosure that the chip package constitutes, the programmable metasurface allows us to tailor the on-chip channel impulse response. Our numerical studies suggest that this approach may overcome the caveat of current wireless interconnects. © 2021 IEEE.
- Published
- 2021