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155 results on '"microvoids"'

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1. The Influence of Microstructure Evolution in Thick Plate 9%Ni Steel Submerged Arc Welding Joint on Fracture Toughness Properties.

3. Micro-to-Nanoscale Characterization of Femtosecond Laser Photo-Inscribed Microvoids.

4. Deciphering the Fracture Initiation Mechanism in Additive-Manufactured 17-4 Steel.

5. Evaluation of Microvoid and Microleakage Potential of Bulk-Fill Resin Composites in MOD Restorations.

6. Small-angle x-ray scattering analysis of carbon fiber voids considering void length distribution

7. Effect of Grain Size on Adiabatic Shear Sensitivity of AZ31 Magnesium Alloys.

8. Micro-to-Nanoscale Characterization of Femtosecond Laser Photo-Inscribed Microvoids

9. Ratiometric synthesis of non-traditional polyesters from poly (ethylene glycol) and trimesic acid tethering bioapplication.

10. Characteristics and micromechanisms of fish-eye crack initiation of a Ti-6Al-4V alloy in very high cycle fatigue regime

11. Phase Field Simulation of Intermetallic Compound Evolution at the Interface of Copper–Tin Coating Under Thermal–Mechanical–Electrical Diffusion Coupling.

12. Injecting n-BuOH to achieve density conversion of dense non-aqueous phase liquid: Pore-scale experimental simulation

13. The effect of microstructure on the performance of nickel based alloys for use in oil and gas applications

14. Effect of Heat Treatment on the Formability of Zn‐Coated Hot Stamping Steel.

15. Effect of Vibration Frequency on Microstructure and Properties of Laser-Welded Inconel 718 Nickel-Base Superalloy.

16. Micromechanical analysis of composite materials considering material variability and microvoids.

17. The Influence of Casting Microvoids on the Constitutive Behavior of As-Quenched Al-Cu-Mn Alloy.

19. Correlation between mechanical properties and Cu precipitates induced by neutron irradiation of Fe[sbnd]Cu alloys.

20. Impulse pressure-assisted diffusion bonding of ferritic stainless steel.

21. EFFECT OF VACUUM DRYING ON MICROSTRUCTURE OF SEMI-SOLID CHEESE

23. The Coupled Effect of Fiber Volume Fraction and Void Fraction on Hydraulic Fluid Absorption of Quartz/BMI Laminates.

24. Numerical simulations of migration and coalescence behavior of microvoids driven by diffusion and electric field in solder interconnects.

25. Microstructural evolution and changes in mechanical property of irradiated Fe–0.6Cu alloy under uniaxial tension stress in reactor.

26. Effect of Laminate Edge Conditions on the Formation of Microvoids in Composite Laminates.

27. Evaluation of biodegradable Zn–1Mg–1Mn and Zn–1Mg–1Mn-1HA composites with a polymer-ceramics coating of PLA/HA/TiO2 for orthopaedic applications.

28. Characterization of microvoids in thin hydrogenated amorphous silicon layers by spectroscopic ellipsometry and Fourier transform infrared spectroscopy.

29. Enhanced mechanical and hydrophobic properties of polyimide fibers containing benzimidazole and benzoxazole units.

31. Evaluation of biodegradable Zn-1Mg-1Mn and Zn-1Mg-1Mn-1HA composites with a polymer-ceramics coating of PLA/HA/TiO 2 for orthopaedic applications.

32. Critical Review of Ductile Fracture Criteria for Steels.

33. Investigation of magnetic, mechanical and microfailure behavior of ARMCO-type low carbon steel corroded in 3.5% NaCl-aqueous solution.

34. Growth kinetics of the Cu3Sn phase and void formation of sub-micrometre solder layers in Sn–Cu binary and Cu–Sn–Cu sandwich structures.

35. Computational Investigation of the Evolution of Intermetallic Compounds Affected by Microvoids During the Solid-State Aging Process in the Cu-Sn System.

36. Microstructure Development and Lateral Distribution of Defects in Ultra-fine Grained Copper Prepared by High-pressure Torsion.

37. Mechanical and damage analysis along a flat-rolled wire cold forming schedule.

38. Reprint of: Molecular modeling of soil organic matter: Squaring the circle?

39. Microvoid Formation at Solder-Copper Interfaces During Annealing: a Systematic Study of the Root Cause.

40. Molecular modeling of soil organic matter: Squaring the circle?

41. Effects of Ni Additions on the Growth of CuSn in High-Lead Solders.

42. Kinetics of Intermetallic Compound Formation at the Interface Between Sn-3.0Ag-0.5Cu Solder and Cu-Zn Alloy Substrates.

43. Strain rate sensitivity of nanocrystalline Au films at room temperature

44. Influence of substrate temperature on growth of a-Si:H films by reactive facing target sputtering deposition.

45. Inhibiting the formation of microvoids in Cu3Sn by additions of Cu to solders

46. A brittle-fracture methodology for three-dimensional visualization of ductile deformation micromechanisms

47. Simulations of instability in dynamic fracture by the cracking particles method

48. Estimation of Gurson material parameters in bimetallic weldments for the nuclear reactor heat transport piping system.

49. Defects in HgTe and CdHgTe Grown by Molecular Beam Epitaxy.

50. Formation of Cu precipitates and vacancy clusters in neutron-irradiated Fe-Cu alloys.

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