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Metal mesh transparent electrodes present a promising alternative to Indium-Tin Oxide (ITO) due to their adjustable period and favourable trade-off between transmittance and conductivity. In this work, a template-free, non-high temperature hybrid additive manufacturing approach of the polyacrylonitrile (PAN)/Cu core–shell structure high-resolution metal mesh flexible transparent electrode (FTE) is proposed. The electric field-driven (EFD) 3D printing method was employed to print ultra-fine lines with widths as low as 1 μm. The composite-plating process combining electroless plating and electroplating has solved the structural defects of single deposition process. The prepared FTE has an excellent conductivity down to 1 Ω/sq and 89% light transmission (at 550 nm). Its exceptional mechanical properties and environmental stability make it suitable for diverse working environments. Even after undergoing 2000 bends at a radius of 3 mm, the resistance change rate remains as low as 1.4%. The resistance exhibits an approximately 8% change rate in the acid–base environment experiments conducted over 72 h. The flexible touch screen prepared with this FTE exhibits excellent writing performance in both flat and curved working scenarios. Furthermore, the significant potential of this FTE in the field of optoelectronics is effectively demonstrated through its exceptional luminescent performance in electroluminescent devices.

Microscale 3D printing is rapidly transforming the pharmaceutical landscape, offering unprecedented precision and customization in drug formulation and drug delivery systems. This paper explores the current state of the field, highlighting key findings and emerging trends. Microscale 3D printing enables the creation of patient-specific dosages and personalized dosage forms, ushering in an era of precision medicine. Integration with biopharmaceuticals presents novel opportunities in regenerative medicine, with the potential for organ and tissue production. Moreover, the technology holds promise for cost savings and ethical considerations, though challenges in regulation and data protection loom. The future of microscale 3D printing in pharmaceuticals is one of precision, customization and promise, where healthcare is patient-centric and cost-effective. This paper provides a comprehensive overview of the subject and underscores the transformative power of this technology. [ABSTRACT FROM AUTHOR]

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Flexible transparent electrodes (FTEs) with embedded metal meshes play an indispensable role in many optoelectronic devices due to their excellent mechanical stability and environmental adaptability. However, low-cost, simple, efficient, and environmental friendly integrated manufacturing of high-performance embedded metal meshes remains a huge challenge. Here, a facile and novel fabrication method is proposed for FTEs with an embedded metal mesh via liquid substrateelectric-field-driven microscale 3D printing process. This direct printing strategy avoids tedious processes and offers low-cost and high-volume production, enabling the fabrication of high-resolution, high-aspect ratio embedded metal meshes without sacrificing transparency. The final manufactured FTEs with 80 mm × 80 mm embedded metal mesh offers excellent optoelectronic performance with a sheet resistance (Rs) of 6 𝛀 sq-1 and a transmittance (T) of 85.79%. The embedded metal structure still has excellent mechanical stability and good environmental suitability under different harsh working conditions. The practical feasibility of the FTEs is successfully demonstrated with a thermally driven 4D printing structure and a resistive transparent strain sensor. This method can be used to manufacture large areas with facile, high-efficiency, low-cost, and high-performance FTEs. [ABSTRACT FROM AUTHOR]

Flexible transparent electrodes are widely used in flexible displays, optoelectronic devices, flexible heating/electromagnetic shielding devices, and flexible sensors. However, significant challenges remain to obtain stable service under harsh environments, owing to the limitations of flexible transparent substrates and conductive materials. Herein, a simple and cost‐effective fabrication approach for harsh‐environment flexible transparent electrodes (HFTEs) is demonstrated via the electric field‐driven microscale 3D printing of a silver mesh on a colorless polyimide (CPI) substrate. Vertical jet orientation on the CPI substrate is realized by controlling the printing parameters, which effectively reduce the instability of the cone jet and is conducive to the preparation of the high‐precision silver mesh on the CPI substrate. The HFTE exhibits good optoelectronic properties (resistance of 4.82 Ω sq−1 and transmittance of 92.26%), and excellent extreme environmental stability with a negligible increase in sheet resistance under various cyclic tests (200 000 bending cycles, 100 adhesion tests, high temperature heating capacity of 360 °C, 80 h of chemical attack, and 120 days of atmospheric environment attack). Baking of quail eggs and deicing experiments are also conducted, which successfully demonstrate the practical viability of the HFTE. Thus, the proposed technique offers a simple and efficient solution for the manufacturing of HFTEs. [ABSTRACT FROM AUTHOR]

Abstract Flexible transparent electrodes (FTEs) with embedded metal meshes play an indispensable role in many optoelectronic devices due to their excellent mechanical stability and environmental adaptability. However, low‐cost, simple, efficient, and environmental friendly integrated manufacturing of high‐performance embedded metal meshes remains a huge challenge. Here, a facile and novel fabrication method is proposed for FTEs with an embedded metal mesh via liquid substrateelectric‐field‐driven microscale 3D printing process. This direct printing strategy avoids tedious processes and offers low‐cost and high‐volume production, enabling the fabrication of high‐resolution, high‐aspect ratio embedded metal meshes without sacrificing transparency. The final manufactured FTEs with 80 mm × 80 mm embedded metal mesh offers excellent optoelectronic performance with a sheet resistance (Rs) of 6 Ω sq−1 and a transmittance (T) of 85.79%. The embedded metal structure still has excellent mechanical stability and good environmental suitability under different harsh working conditions. The practical feasibility of the FTEs is successfully demonstrated with a thermally driven 4D printing structure and a resistive transparent strain sensor. This method can be used to manufacture large areas with facile, high‐efficiency, low‐cost, and high‐performance FTEs.

Three-dimensional (3D) cell culture methods have been widely used on a range of cell types, including stem cells to modulate precisely the cellular biophysical and biochemical microenvironment and control various cell signaling cues. As a result, more in vivo-like microenvironments are recapitulated, particularly through the formation of multicellular spheroids and organoids, which may yield more valid mechanisms of disease. Recently, genome-engineering tools such as CRISPR Cas9 have expanded the repertoire of techniques to control gene expression, which complements external signaling cues with intracellular control elements. As a result, the combination of CRISPR Cas9 and 3D cell culture methods enhance our understanding of the molecular mechanisms underpinning several disease phenotypes and may lead to developing new therapeutics that may advance more quickly and effectively into clinical candidates. In addition, using CRISPR Cas9 tools to rescue genes brings us one step closer to its use as a gene therapy tool for various degenerative diseases. Herein, we provide an overview of bridging of CRISPR Cas9 genome editing with 3D spheroid and organoid cell culture to better understand disease progression in both patient and non-patient derived cells, and we address potential remaining gaps that must be overcome to gain widespread use.

During the past decades, microdevices have been evaluated as a means to overcome challenges within oral drug delivery, thus improving bioavailability. Fabrication of microdevices is often limited to planar or simple 3D designs. Therefore, this work explores how microscale stereolithography 3D printing can be used to fabricate radiopaque microcontainers with enhanced mucoadhesive geometries, which can enhance bioavailability by increasing gastrointestinal retention. Ex vivo force measurements suggest increased mucoadhesion of microcontainers with adhering features, such as pillars and arrows, compared to a neutral design. In vivo studies, utilizing planar X-ray imaging, show the time-dependent gastrointestinal location of microcontainers, whereas computed tomography scanning and cryogenic scanning electron microscopy reveal information about their spatial dynamics and mucosal interactions, respectively. For the first time, the effect of 3D microdevice modifications on gastrointestinal retention is traced in vivo, and the applied methods provide a much-needed approach for investigating the impact of device design on gastrointestinal retention., (© 2022 The Authors. Advanced Healthcare Materials published by Wiley-VCH GmbH.)

Transparent glass with metal mesh is considered a promising strategy for high performance transparent glass heaters (TGHs). However, the realization of simple, low-cost manufacture of high performance TGHs still faces great challenges. Here, a technique for the fabrication of high performance TGHs is proposed using liquid sacrificial substrate electric-field-driven (LS-EFD) microscale 3D printing of thick film silver paste. The liquid sacrificial substrate not only significantly improves the aspect ratio (AR) of silver mesh, but also plays a positive role in printing stability. The fabricated TGHs with a line width of 35 µm, thickness of 12.3 µm, and pitch of 1000 µm exhibit a desirable optoelectronic performance with sheet resistance (R s ) of 0.195 Ω sq -1 and transmittance (T) of 88.97%. A successful deicing test showcases the feasibility and practicality of the manufactured TGHs. Moreover, an interface evaporator is developed for the coordination of photothermal and electrothermal systems based on the high performance TGHs. The vapor generation rate of the device reaches 10.69 kg m -2 h -1 with a voltage of 2 V. The proposed technique is a promising strategy for the cost-effective and simple fabrication of high performance TGHs., (© 2022 Wiley-VCH GmbH.)

• Presented a process for 3D printing of high quality, and pure Copper interconnects. • Investigated the thermal stability of the printed metal microstructures. • An upper bound limit of 300 °C was identified using SEM/FIB and in situ SEM micro-compression experiment. Micro/nanoscale 3D printing of metals is promising for printed electronics and sensors. It is important to evaluate how material properties of the microscale 3D-printed metals change at high temperature, though such studies are currently very limited. Here, we investigate morphological and mechanical property changes in copper interconnects 3D-printed by pulsed electrodeposition process. The results revealed significant surface damage and void formation in printed Cu after annealing at 450 °C. No significant surface damages or voids were observed for printed Cu annealed at 300 °C, however, their strength dropped ~40% from the strength of the as-deposited material (~868 MPa). Such results are important to determine the operation temperature range for interconnects fabricated by microscale 3D printing. [ABSTRACT FROM AUTHOR]

Flexible transparent electrodes (FTEs) with an embedded metal mesh are considered a promising alternative to traditional indium tin oxide (ITO) due to their excellent photoelectric performance, surface roughness, and mechanical and environmental stability. However, great challenges remain for achieving simple, cost-effective, and environmentally friendly manufacturing of high-performance FTEs with embedded metal mesh. Herein, a maskless, templateless, and plating-free fabrication technique is proposed for FTEs with embedded silver mesh by combining an electric-field-driven (EFD) microscale 3D printing technique and a newly developed hybrid hot-embossing process. The final fabricated FTE exhibits superior optoelectronic properties with a transmittance of 85.79%, a sheet resistance of 0.75 Ω sq -1 , a smooth surface of silver mesh (R a  ≈ 18.8 nm) without any polishing treatment, and remarkable mechanical stability and environmental adaptability with a negligible increase in sheet resistance under diverse cyclic tests and harsh working conditions (1000 bending cycles, 80 adhesion tests, 120 scratch tests, 100 min ultrasonic test, and 72 h chemical attack). The practical viability of this FTE is successfully demonstrated with a flexible transparent heater applied to deicing. The technique proposed offers a promising fabrication strategy with a cost-effective and environmentally friendly process for high-performance FTE., (© 2021 Wiley-VCH GmbH.)

The metallic interconnects are essential components of energy devices such as fuel cells and electrolysis cells, batteries, as well as electronics and optoelectronic devices. In recent years, 3D printing processes have offered complementary routes to the conventional photolithography- and vacuum-based processes for interconnect fabrication. Among these methods, the confined electrodeposition (CED) process has enabled a great control over the microstructure of the printed metal, direct printing of high electrical conductivity (close to the bulk values) metals on flexible substrates without a need to sintering, printing alloys with controlled composition, printing functional metals for various applications including magnetic applications, and for in situ scanning electron microscope (SEM) nanomechanical experiments. However, the metal deposition rate (or the overall printing speed) of this process is reasonably slow because of the chemical nature of the process. Here, we propose using the CED process to print a single layer of a metallic trace as the seed layer for the subsequent selected-area electroless plating. By controlling the activation sites through printing by the CED process, we control, where the metal grows by electroless plating, and demonstrate the fabrication of complex thin-film patterns. Our results show that this combined process improves the processing time by more than 2 orders of magnitude compared to the layer-by-layer printing process by CED. Additionally, we obtained Cu and Ni films with an electrical resistivity as low as ∼1.3 and ∼2 times of the bulk Cu and Ni, respectively, without any thermal annealing. Furthermore, our quantitative experiments show that the obtained films exhibit mechanical properties close to the bulk metals with an excellent adhesion to the substrate. We demonstrate potential applications for radio frequency identification (RFID) tags, for complex printed circuit board patterns, and resistive sensors in a Petri dish for potential biological applications.

Three-dimensional (3D) cell culture methods have been widely used on a range of cell types, including stem cells to modulate precisely the cellular biophysical and biochemical microenvironment and control various cell signaling cues. As a result, more in vivo -like microenvironments are recapitulated, particularly through the formation of multicellular spheroids and organoids, which may yield more valid mechanisms of disease. Recently, genome-engineering tools such as CRISPR Cas9 have expanded the repertoire of techniques to control gene expression, which complements external signaling cues with intracellular control elements. As a result, the combination of CRISPR Cas9 and 3D cell culture methods enhance our understanding of the molecular mechanisms underpinning several disease phenotypes and may lead to developing new therapeutics that may advance more quickly and effectively into clinical candidates. In addition, using CRISPR Cas9 tools to rescue genes brings us one step closer to its use as a gene therapy tool for various degenerative diseases. Herein, we provide an overview of bridging of CRISPR Cas9 genome editing with 3D spheroid and organoid cell culture to better understand disease progression in both patient and non-patient derived cells, and we address potential remaining gaps that must be overcome to gain widespread use., (Copyright © 2020 Gopal, Rodrigues and Dordick.)

Great challenges remain concerning the cost-effective manufacture of high-performance metal meshes for transparent glass heaters (TGHs). Here, a high-performance silver mesh fabrication technique is proposed for TGHs using electric-field-driven microscale 3D printing and a UV-assisted microtransfer process. The results show a more optimal trade-off in sheet resistance (R s = 0.21 Ω sq -1 ) and transmittance (T = 93.9%) than for indium tin oxide (ITO) and ITO substitutes. The fabricated representative TGH also exhibits homogeneous and stable heating performance, remarkable environmental adaptability (constant R s for 90 days), superior mechanical robustness (R s increase of only 0.04 in harsh conditions-sonication at 100 °C), and strong adhesion force with a negligible increase in R s (2-12%) after 100 peeling tests. The practical viability of this TGH is successfully demonstrated with a deicing test (ice cube: 21 cm 3 , melting time: 78 s, voltage and glass thickness: 4 V, 5 mm). All of these advantages of the TGHs are attributed to the successful fabrication of silver meshes with high resolution and high aspect ratio on the glass substrate using the thick film silver paste. The proposed technique is a promising new tool for the inexpensive fabrication of high-performance TGHs., (© 2019 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.)

Nanotwinned (nt)-metals exhibit superior mechanical and electrical properties compared to their coarse-grained and nanograined counterparts. nt-metals in film and bulk forms are obtained using physical and chemical processes including pulsed electrodeposition (PED), plastic deformation, recrystallization, phase transformation, and sputter deposition. However, currently, there is no process for 3D printing (additive manufacturing) of nt-metals. Microscale 3D printing of nt-Cu is demonstrated with high density of coherent twin boundaries using a new room temperature process based on localized PED (L-PED). The 3D printed nt-Cu is fully dense, with low to none impurities, and low microstructural defects, and without obvious interface between printed layers, which overall result in good mechanical and electrical properties, without any postprocessing steps. The L-PED process enables direct 3D printing of layer-by-layer and complex 3D microscale nt-Cu structures, which may find applications for fabrication of metamaterials, sensors, plasmonics, and micro/nanoelectromechanical systems., (© 2017 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.)