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Researchers have found various families of two-dimensional (2D) materials and associated heterostructures through detailed theoretical work and experimental efforts. Such primitive studies provide a framework to investigate novel physical/chemical characteristics and technological aspects from micro to nano and pico scale. Two-dimensional van der Waals (vdW) materials and their heterostructures can be obtained to enable high-frequency broadband through a sophisticated combination of stacking order, orientation, and interlayer interactions. These heterostructures have been the focus of much recent research due to their potential applications in optoelectronics. Growing the layers of one kind of 2D material over the other, controlling absorption spectra via external bias, and external doping proposes an additional degree of freedom to modulate the properties of such materials. This mini review focuses on current state-of-the-art material design, manufacturing techniques, and strategies to design novel heterostructures. In addition to a discussion of fabrication techniques, it includes a comprehensive analysis of the electrical and optical properties of vdW heterostructures (vdWHs), particularly emphasizing the energy-band alignment. In the following sections, we discuss specific optoelectronic devices, such as light-emitting diodes (LEDs), photovoltaics, acoustic cavities, and biomedical photodetectors. Furthermore, this also includes a discussion of four different 2D-based photodetector configurations according to their stacking order. Moreover, we discuss the challenges that remain to be addressed in order to realize the full potential of these materials for optoelectronics applications. Finally, as future perspectives, we present some key directions and express our subjective assessment of upcoming trends in the field. [ABSTRACT FROM AUTHOR]

Abstract Contamination on two-dimensional (2D) crystal surfaces poses serious limitations on fundamental studies and applications of 2D crystals. Surface residues induce uncontrolled doping and charge carrier scattering in 2D crystals, and trapped residues in mechanically assembled 2D vertical heterostructures often hinder coupling between stacked layers. Developing a process that can reduce the surface residues on 2D crystals is important. In this study, we explored the use of atomic force microscopy (AFM) to remove surface residues from 2D crystals. Using various transmission electron microscopy (TEM) investigations, we confirmed that surface residues on graphene samples can be effectively removed via contact-mode AFM scanning. The mechanical cleaning process dramatically increases the residue-free areas, where high-resolution imaging of graphene layers can be obtained. We believe that our mechanical cleaning process can be utilized to prepare high-quality 2D crystal samples with minimum surface residues.

Micro light-emitting diodes (micro-LEDs) are pivotal in next-generation display technologies, driven by the need for high pixel density. This study introduces a novel methodology utilizing wide sapphire nanomembranes (W-SNM) as a dual-purpose template for high-quality epitaxial growth and the mechanical lift-off of individual micro-LEDs. Micro-LEDs grow individually on W-SNM, obviating the chip singulation process. By employing mechanical fracturing of the thin W-SNM, our method facilitates the transfer of micro-LEDs without the conventional laser lift-off (LLO) process. Previously introduced sapphire nanomembranes (SNM) have shown promise in enhancing epitaxial layer quality; however, they encountered challenges in managing micro-LED size variation and achieving efficient mechanical transfer. Here, we apply simple yet effective adjustments to the SNM structure, specifically, its elevation and widening. This strategic modification allows micro-LEDs to endure applied forces without incurring cracks or defects, ensuring that only the targeted W-SNM are selectively fractured. The mechanically transferred vertical 15 × 15 μm 2 micro-LED device operates at an optimal turn-on voltage of 3.3 V. Finite element simulations validate the mechanical strain distribution between the W-SNM and GaN when pressure is applied, confirming the efficacy of our design approach. This pioneering methodology offers a streamlined, efficient pathway for the production and mechanical transfer of micro-LEDs, presenting new avenues for their integration into next-generation, high-performance displays.

Contamination on two-dimensional (2D) crystal surfaces poses serious limitations on fundamental studies and applications of 2D crystals. Surface residues induce uncontrolled doping and charge carrier scattering in 2D crystals, and trapped residues in mechanically assembled 2D vertical heterostructures often hinder coupling between stacked layers. Developing a process that can reduce the surface residues on 2D crystals is important. In this study, we explored the use of atomic force microscopy (AFM) to remove surface residues from 2D crystals. Using various transmission electron microscopy (TEM) investigations, we confirmed that surface residues on graphene samples can be effectively removed via contact-mode AFM scanning. The mechanical cleaning process dramatically increases the residue-free areas, where high-resolution imaging of graphene layers can be obtained. We believe that our mechanical cleaning process can be utilized to prepare high-quality 2D crystal samples with minimum surface residues. [ABSTRACT FROM AUTHOR]

Abstract: Direct graphene transfer is an attractive candidate to prevent graphene damage, which is a critical problem of the conventional wet transfer method. Direct graphene transfer can fabricate the transferred graphene film with fewer defects by using a polymeric carrier. Here a unique direct transfer method is proposed using a 300 nm thick copper carrier as a suspended film and a transfer printing process by using the polydimethylsiloxane (PDMS) stamp under controlled peeling rate and modulus. Single and multilayer graphene are transferred to flat and curved PDMS target substrate directly. With the transfer printing process, the transfer yield of a trilayer graphene with 1000 µm s−1 peeling rate is 68.6% of that with 1 µm s−1 peeling rate. It is revealed that the graphene transfer yield is highly related to the storage modulus of the PDMS stamp: graphene transfer yield decreases when the storage modulus of the PDMS stamp is lower than a specific threshold value. The relationship between the graphene transfer yield and the interfacial shear strain of the PDMS stamp is studied by finite‐element method simulation and digital image correlation. [ABSTRACT FROM AUTHOR]

We propose a wafer-level procedure for the fabrication of 1.5-mm-diameter dual functioning InGaN/GaN multiple-quantum-well (MQW) diodes on a GaN-on-silicon platform for transferrable optoelectronics. Nitride semiconductor materials are grown on (111) silicon substrates with intermediate Al-composition step-graded buffer layers, and membrane-type MQW-diode architectures are obtained by a combination of silicon removal and III-nitride film backside thinning. Suspended MQW-diodes are directly transferred from silicon to foreign substrates such as metal, glass and polyethylene terephthalate by mechanically breaking the support beams. The transferred MQW-diodes display strong electroluminescence under current injection and photodetection under light irradiation. Interestingly, they demonstrate a simultaneous light-emitting light-detecting function, endowing the 1.5-mm-diameter MQW-diode with the capability of producing transferrable optoelectronics for adjustable displays, wearable optical sensors, multifunctional energy harvesting, flexible light communication and monolithic photonic circuit. [ABSTRACT FROM AUTHOR]

This study aims to analyze the factors that justify the low use of a mechanical transfer in the context of a long-term institution. It is a device intended for internal transportation of individuals who have mobility problems. The analysis involves researchers from the fields of health and engineering in order to generate design criteria that consider the needs of caregivers and patients of this institution. To understand the reality of this site and their specificities, was used Ergonomic Work Analysis. [ABSTRACT FROM AUTHOR]

[Display omitted] • Adhesion energy of the graphene–Cu interface is controlled by various liquids. • Thermodynamic work of adhesion reveals the mechanism of adhesion control. • Effective reduction of damage to graphene during the transfer process is achieved. • Transferred graphene shows superior properties and is applicable to flexible devices. Mechanical transfer of synthesized graphene has attracted considerable attention owing to its widely applicable and substrate recyclable process. Particularly, the interfacial adhesion energy between graphene and the growth Cu substrate plays an important role in the mechanical transfer of graphene without compromising its quality and properties. However, the quantitative control of adhesion for the graphene–Cu interface has remained a challenge. Here, we introduce liquid-assisted adhesion control of the graphene–Cu interface for a damage-free mechanical transfer process. It is demonstrated using environmentally assisted fracture mechanics testing that the adhesion energy of the graphene–Cu interface can be controlled by separating the interface in liquid environments. Analysis of the wetting characteristics for each surface and the thermodynamic work of adhesion calculation reveal the mechanism of liquid-assisted adhesion control. Liquid-assisted adhesion control effectively reduces structural defects in the transferred graphene layers. Finally, the applicability of the adhesion-controlled graphene transfer method to flexible and stretchable electronics is investigated. [ABSTRACT FROM AUTHOR]

Calonectria pseudonaviculata and Pseudonectria foliicola causing the infamous "boxwood blight" and "Volutella blight," respectively, are a constant threat to the boxwood production and cut boxwood greenery market. Both pathogens cause significant economic loss to all parties (growers, retailer, and customers) in the horticultural chain. The objective of this study was to evaluate efficacy of disinfesting chemicals (quaternary ammonium compound [QAC], peroxy, acid, alcohol, chlorine, and cleaner) in preventing plant-to-plant transfer of C. pseudonaviculata and P. foliicola via cutting tools, as well as reduction of postharvest boxwood blight and Volutella blight disease severity in harvested boxwood greenery. First, an in vitro study was conducted to select products and doses that completely or near-completely inhibited conidial germination of C. pseudonaviculata and P. foliicola . The selected treatments were also tested for their ability to reduce plant-to-plant transfer of C. pseudonaviculata and P. foliicola and manage postharvest boxwood blight and Volutella blight in boxwood cuttings. For the plant-to-plant transfer study, Felco 19 shears were used as a tool for mechanical transfer of fungal conidia. The blades of Felco 19 shears were exposed to a conidial suspension of C. pseudonaviculata or P. foliicola by cutting a 1-cm-diameter cotton roll that had been dipped into a fungal suspension. Disease-free boxwood rooted cuttings (10-cm height) were pruned with the contaminated shears. The Felco 19 shears were equipped with a mounted miniature sprayer connected to a pressurized reservoir of treatment solution that automatically sprayed the blade and plant surface while cutting. The influence of accumulated sap on the shear blade was studied through 1- or 10-cut pruning variable on test plants and screened for the efficacy of treatments. Then, the boxwood rooted cuttings were transplanted and incubated in room conditions (21°C, 60% RH) with 12 h of fluorescent light; data evaluation on disease severity was done weekly for a month. Disease progress (area under disease progress curve [AUDPC]) was calculated. In another study, postharvest dip application treatments were used for the management of postharvest boxwood blight or Volutella blight on boxwood cuttings. The harvested boxwood cuttings were inoculated with a conidial suspension of C. pseudonaviculata or P. foliicola and then dipped into treatment solution 3 days afterward. The treated boxwood cuttings were kept in room conditions, and boxwood blight or Volutella blight disease severity as well as marketability (postharvest shelf life) was assessed every 2 days for 1 week. A significant difference between treatments was observed for reduction of boxwood blight or Volutella blight severity and AUDPC. The treatments [Octyl decyl dimethyl (ODD) + dioctyl dimethyl (DoD) + didecyl dimethyl (DdD) + dimethyl benzyl (DB)] ammonium chloride (AC) (Simple Green D Pro 5), 2-propanol + didecyl dimethyl ammonium chloride (DDAC) (0.12%; KleenGrow), and dimethyl benzyl ammonium chloride (DBAC) + dimethyl ethylbenzyl ammonium chloride (DEAC) (GreenShield) were the most effective in reducing the plant-to-plant transfer of boxwood blight and Volutella blight when pruned with contaminated Felco 19 shears. In addition to the three effective treatments above, acetic acid (2.5%; vinegar), 2-propanol + DDAC (0.06%), sodium hypochlorite (Clorox), and potassium peroxymonosulfate + NaCl (2%; Virkon) were effective in reducing postharvest boxwood blight, whereas DBAC + DBAC (Lysol all-purpose cleaner), ethanol (70% [ethyl alcohol]), and DDAC + DBAC (Simple Green D Pro 3 plus) were effective in reducing Volutella blight disease severity and AUDPC, and they also maintained better quality and longer postharvest shelf life of boxwood cuttings when applied as a dip treatment. The longer postharvest shelf life of boxwood cuttings noted may be attributed to reduced disease severity and AUDPC resulting in healthy boxwood cuttings.

A very fast, dry transfer process based on mechanical delamination successfully effected the transfer of large-area, CVD grown graphene on copper foil to silicon. This has been achieved by bonding silicon backing layers to both sides of the graphene-coated copper foil with epoxy and applying a suitably high separation rate to the backing layers. At the highest separation rate considered (254.0 μm/s), monolayer graphene was completely transferred from the copper foil to the target silicon substrate. On the other hand, the lowest rate (25.4 μm/s) caused the epoxy to be completely separated from the graphene. Fracture mechanics analyses were used to determine the adhesion energy between graphene and its seed copper foil (6.0 J/m(2)) and between graphene and the epoxy (3.4 J/m(2)) at the respective loading rates. Control experiments for the epoxy/silicon interface established a rate dependent adhesion, which supports the hypothesis that the adhesion of the graphene/epoxy interface was higher than that of the graphene/copper interface at the higher separation rate, thereby providing a controllable mechanism for selective transfer of graphene in future nanofabrication systems such as roll-to-roll transfer.