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The influence of a change in the rated voltage in a car's electrical system on the operation of the lighting and electronic components is investigated. [ABSTRACT FROM AUTHOR]

Industrial development has implicitly led to the development of new systems that increase the ability to provide services and products in real time. Autonomous mobile robots are considered some of the most important tools that can help both industry and society. These robots offer a certain autonomy that makes them indispensable in industrial activities. However, some elements of these robots are not yet very well outlined, such as their construction, their lifetime and energy consumption, and the environmental impact of their activity. Within the context of European regulations (here, we focus on the Green Deal and the growth in greenhouse gas emissions), any industrial activity must be analyzed and optimized so that it is efficient and does not significantly impact the environment. The added value of this paper is its examination of the activities carried out by mobile robots and the impact of their electronic components on the environment. The proposed analysis employs, as a central point, an analysis of mobile robots from the point of view of their electronic components and the impact of their activity on the environment in terms of energy consumption, as evaluated by calculating the emission of greenhouse gases (GHGs). The way in which the activity of a robot impacts the environment was established throughout the economic flow, as well as by providing possible methods of reducing this impact by optimizing the robot's activity. The environmental impact of a mobile robot, in regard to its electronic components, will also be analyzed when the period of operation is completed. [ABSTRACT FROM AUTHOR]

As advancements in electronics continued, the limitations of traditional component testers became increasingly evident. Most available testers were designed to evaluate a single component type, resulting in a circuit testing process that was often cumbersome and time-consuming. This inefficiency posed challenges to both learning and innovation in educational and professional environments. To address the growing demand for more efficient and versatile testing tools, the development of a multi-component tester became crucial. The proposed project aimed to create an integrated electronic components tester capable of evaluating a wide range of components, including integrated circuits (ICs), resistors, transistors, and capacitors. This all-in-one device was designed to streamline the testing process, improving the user experience in electronics laboratories and supporting professionals in the fields of electronics repair and development. [ABSTRACT FROM AUTHOR]

Thin-film layers are commonly produced via magnetron sputtering, with experimental exploration typically aimed at determining optimal deposition conditions and understanding the relationship between film quality and deposition parameters. Despite the benefits, traditional experimentation poses drawbacks such as time and cost constraints. Hence, employing efficient simulation models is recommended to streamline processes, save resources, and enhance accuracy. This article focuses on developing a computer simulation model for magnetron sputtering deposition, particularly targeting semiconductor materials like silicon (Si) and germanium (Ge) used in modern photovoltaic cells, as well as common electronic components like copper (Cu) and silver (Ag). The simulation model, employing Monte Carlo analysis, accurately predicts thin film deposition and thickness while considering factors such as ejected atom flow, energy, direction, and collision dynamics. The impact of target-substrate distance on deposition performance is also investigated. Comparative analysis between our simulation data and previous works validates the efficacy of the proposed model. [ABSTRACT FROM AUTHOR]

Risk management in electronic component selection is crucial for ensuring inherent system quality dependability in aerospace equipment research and development (R&D). Therefore, it is of great significance to conduct rapid and accurate risk assessment research of electronic components based on engineering practice. This article utilizes the extreme gradient boosting (XGBoost) algorithm and domain knowledge to assess electronic component selection risk. Firstly, an innovative risk assessment system is established for electronic component selection based on business materials analysis and investigation by questionnaire. Then, the values of factors in the system are quantified based on domain knowledge and empirical formulae. Finally, an XGBoost-based risk assessment model is constructed that can explore learning strategies and develop latent features by integrating multiple decision trees. The model is compared against the random forest (RF), support vector machine (SVM) and decision tree (DT) algorithms. Accuracy, precision, recall, and F1 score are used as evaluation indexes. The results obtained from the above algorithms illustrate the effectiveness of the proposed method in electronic component selection risk assessment. [ABSTRACT FROM AUTHOR]

Although several techniques have been developed to extract copper from waste printed circuit boards (PCBs), there remain several challenges regarding energy consumption, local area contamination and environmental damage. A novel technique has been developed for extracting copper foils from waste PCBs based on low temperature pyrolysis followed by exfoliation to overcome these issues. The standard pretreatment steps of removing electronic components from PCBs and mechanical processing/size-reduction/powdering, etc., were minimized in this study. Several unsorted 'as received' PCBs were heat treated in the temperature range 750–850 °C for 5–20 min. in an argon atmosphere. Brittle dark chars and other residues on the heat-treated specimens were scrapped off to separate copper foils and other residuals. Most of the electronic components mounted on PCBs had dropped off during the heat treatment. Good-quality copper foils were recovered in all cases; the purity of copper was in excess of 85 wt.%. Key impurities present were Pb, Sn and Zn with typical concentrations less than 4 wt.%. Key features of the technique include minimizing energy intensive pre-treatment processes and waste handling, low pyrolysis temperatures and short heating times. This energy-efficient approach has the potential to enhance resource recovery while reducing the loss of materials, local area contamination and pollution near e-waste processing facilities. [ABSTRACT FROM AUTHOR]

Electronic components are the main components of PCBs (printed circuit boards), so the detection and classification of ECs (electronic components) is an important aspect of recycling used PCBs. However, due to the variety and quantity of ECs, traditional target detection methods for EC classification still have problems such as slow detection speed and low performance, and the accuracy of the detection needs to be improved. To overcome these limitations, this study proposes an enhanced YOLO (you only look once) network (EC-YOLOv7) for detecting EC targets. The network uses ACmix (a mixed model that enjoys the benefits of both self-attention and convolution) as a substitute for the 3 × 3 convolutional modules in the E-ELAN (Extended ELAN) architecture and implements branch links and 1 × 1 convolutional arrays between the ACmix modules to improve the speed of feature retrieval and network inference. Furthermore, the ResNet-ACmix module is engineered to prevent the leakage of function data and to minimise calculation time. Subsequently, the SPPCSPS (spatial pyramid pooling connected spatial pyramid convolution) block has been improved by replacing the serial channels with concurrent channels, which improves the fusion speed of the image features. To effectively capture spatial information and improve detection accuracy, the DyHead (the dynamic head) is utilised to enhance the model's size, mission, and sense of space, which effectively captures spatial information and improves the detection accuracy. A new bounding-box loss regression method, the WIoU-Soft-NMS method, is finally suggested to facilitate prediction regression and improve the localisation accuracy. The experimental results demonstrate that the enhanced YOLOv7 net surpasses the initial YOLOv7 model and other common EC detection methods. The proposed EC-YOLOv7 network reaches a mean accuracy (mAP@0.5) of 94.4% on the PCB dataset and exhibits higher FPS compared to the original YOLOv7 model. In conclusion, it can significantly enhance high-density EC target recognition. [ABSTRACT FROM AUTHOR]

A procedure is developed for producing basic electronic components utilizing materials sourced from discarded orange, grapefruit, lemon, apple, banana, potato, and carrot peels. Initially, these materials undergo dehydration, followed by a meticulous pulverization process to obtain fine powder. Natural adhesives like water, honey, sugar, starch, and gelatin are employed to interconnect the materials. Formed substrates are characterized using Scanning Electron Microscopy, Energy Dispersive X‐ray Spectroscopy, and an optical profilometer. Furthermore, the relative permittivity of the materials is determined. Three distinct types of substrates, derived from the aforementioned peels, are crafted in varying dimensions. Substrates measuring 4 cm × 2.5 cm host interdigital capacitive sensors, whereas larger 6 cm × 3.5 cm substrates accommodate inductor‐capacitor (LC) sensors. Each of the six samples undergoes individual dry testing, while LC sensors are additionally tested with the post‐application of artificial saliva and mouthwash liquids. The sensor's characterization involves measurement of impedance and phase angle for all samples. Capacitance is additionally measured for capacitors, and inductance for LC circuits. These assessments are carried out within the frequency range spanning from 1 MHz to 400 MHz. The objective is the development of fully functional electronic components, derived from discarded edible items, fostering sustainable practices, and finding applications in biomedicine. [ABSTRACT FROM AUTHOR]

A novel approach has been introduced to estimate the parameters of exponential and DN distributions during the rejection testing of electronic devices, accompanied by a detailed procedure for its implementation. This innovative method enhances noise immunity and minimizes the error associated with the rejection process through the application of a clustering technique involving wavelet transform. The effectiveness of the method has been verified using resistors, employing criteria such as noise level and stability. The substantial improvement in noise immunity and the reduction in rejection procedure errors are achieved by incorporating an adaptive clustering method coupled with wavelet transform. Notably, in clustering with a signal-to-noise ratio by amplitude of 1.17, the relative error in determining the minimum of the test function was reduced to 8.32%. These promising outcomes substantiate the recommendation of the developed method for the automated selection of resistors, particularly those designated for long-term operational equipment with critical applications. The presented method thus contributes significantly to enhancing the reliability and accuracy of electronic device testing and selection processes.

The traditional reliability test is time-consuming and requires high cost. Therefore, this article provided the basic content and workflow of reliability simulation and conducted reliability simulation modeling, thermal stress simulation analysis, vibration stress simulation analysis, fault prediction, and reliability evaluation for typical electronic components in a certain torpedo product, so as to obtain weak links in product design, potential fault information, and average first failure time. The analysis results show that the reliability simulation can ensure the elimination of fault sources in the early stage of torpedo product design and thus improve torpedo product robustness and fault prediction ability.

The work presents a part of the electronic components, passive, active, integrated, linear and digital circuits, produced in Romania, exhibited in the Museum of the Faculty of Engineering in Reșita, with which the students of the Faculty of Engineering worked in applied didactic activities, in the over 50 years of university activity at Reșita. A few of these are still present in some teaching activities in the laboratories, which highlights their quality. In the paper, several types of electronic components are listed, then presented in figures so that, as far as possible, they can be identified by type. Thus, their positioning was done so that identification elements could be distinguished (abbreviations IPRS, IPEE, ME, letter β, component code), and in some cases original labels/packaging containing identification elements were also placed. Alongside, bibliographical sources are indicated, usually company catalogs, in which there is a detailed presentation of the technical parameters of the components. These components, initially made on the basis of licenses from prestigious companies from France, Italy, the USA, but also others, and then as a result of own research, allowed the Romanian electronics industry to be one among the first in the world in the 1970s and 1980s. We believe that the issue addressed is important, in the context where almost all Romanian factories producing electronic components no longer work, but at the same time, the Romanian management factors the problem of Romania's reindustrialization, in which the IT field occupies an important place. [ABSTRACT FROM AUTHOR]

Population expansion and improving living standards, particularly in developed nations, have led to an increase in the usage of domestic electrical equipment, worldwide energy consumption, and CO2 emissions per capita. To limit the usage of non-reusable components and the amount of garbage that must be transferred at the end of a product's life cycle, longer-lasting electrical domestic appliances are a pillar of the circular economy. In recent years, the complexity of printed circuit boards (PCBs) used in the manufacture of modern electrical devices has increased, leading to an increase in device failures. This study focuses on the maintenance and recycling of domestic electrical appliance components and printed circuit boards. The proposed methodology for PCB repair is defined as a sequential quadratic programming (SQP) problem implemented in MATLAB environment and successfully tested to a variety of domestic appliances such as refrigerator, dishwasher and washing machine. The possibility of recycling metal parts of electronic components, which were replaced after PCBs' repair was also studied. Metals' percentage concentration of PCB electronic components for three customer's budgets considering metals and valuable metals recovery as given from the corresponding average metal recovery and calculated from different recycling procedures presented in the literature. The results of the proposed procedure in terms of valuable metals gave 38.4078 ppm of silver. We also compared the suggested procedure with other works in terms of environmental perspective considering four measures, namely the gross energy requirement (GER), the global warming potential (GWP), the acidification potential (AP), and the solid waste burden (SWB). In terms of economic perspective and considering the existence of silver (Ag) in the electronic components, the recommended method gave comparable amount of money. Finally, a comparison of different recycling works from a technical viewpoint is also conducted. Moreover, a reparability index of domestic electrical appliances is introduced to further quantify the results of the proposed algorithm. [ABSTRACT FROM AUTHOR]

This article analyses several promising policies in the electronic parts industry for disrupting the flow of counterfeit electronic parts. A socio-technical electronic part supply-chain network model has been developed to facilitate policy analysis. The model is used to understand the technical and social dynamics associated with the insertion of counterfeit electronic components into critical systems (e.g., aerospace, transportation, defense, and infrastructure) and to analyze the impact of various anti-counterfeiting policies and practices. This network model is used to assess the effectiveness of mandatory original component manufacturer buyback programs and the debarment of distributors found to provide counterfeit components. In this agent-based model, each participant in the supply chain is modeled as an independent entity governed by its own motivations and constraints. The entities in the model include the original component manufacturers, distributors, system integrators, operators, and counterfeiters. Each of these entities has dynamic behaviors and connections to the other agents. Since time is an integral factor (lead times and inventory levels can be drivers behind the appearance of counterfeits), the simulation is dynamic. The model allows the prediction of the risk of counterfeits making it into an operator's system and the length of time between relevant supply-chain events/disruptions and the appearance of counterfeits. [ABSTRACT FROM AUTHOR]

The electronics industry faces a challenge posed by cracks in multilayer ceramic capacitors (MLCC), which can undermine device reliability and longevity. In this study, we investigate the multifaceted factors underpinning crack formation, unveiling their intimate connections with corrosion, contamination, and mold. We show that hygroscopic properties, humidity exposure, and ion migration, play a role as precursors triggering both the inception and escalation of cracks. The correlation between corrosion, contamination, and cracking mechanisms in MLCCs presents a unique opportunity, as the visibility of corrosion and contamination on the component's exterior offers a distinct advantage for detection, unlike the elusive nature of cracks which are often challenging to identify. We introduce a solution—an encompassing visual inspection methodology designed to detect corrosion evidence on electronic components. This approach employs advanced AI algorithms and pick-and-place machine cameras already in-place to examine all components during assembly. The algorithm detects corrosion indicators, effectively neutralizing the detrimental effects of corrosion and mitigating its potential role in crack formation. Our work includes the presentation of the AI model, which showcases exceptional accuracy in identifying corrosion-associated concerns. This innovative tool is directly confronting a major root cause of cracks. This novel solution marks a substantial stride toward fortifying product reliability and extending the operational lifespan of electronic devices. [ABSTRACT FROM AUTHOR]

Abstract A procedure is developed for producing basic electronic components utilizing materials sourced from discarded orange, grapefruit, lemon, apple, banana, potato, and carrot peels. Initially, these materials undergo dehydration, followed by a meticulous pulverization process to obtain fine powder. Natural adhesives like water, honey, sugar, starch, and gelatin are employed to interconnect the materials. Formed substrates are characterized using Scanning Electron Microscopy, Energy Dispersive X‐ray Spectroscopy, and an optical profilometer. Furthermore, the relative permittivity of the materials is determined. Three distinct types of substrates, derived from the aforementioned peels, are crafted in varying dimensions. Substrates measuring 4 cm × 2.5 cm host interdigital capacitive sensors, whereas larger 6 cm × 3.5 cm substrates accommodate inductor‐capacitor (LC) sensors. Each of the six samples undergoes individual dry testing, while LC sensors are additionally tested with the post‐application of artificial saliva and mouthwash liquids. The sensor's characterization involves measurement of impedance and phase angle for all samples. Capacitance is additionally measured for capacitors, and inductance for LC circuits. These assessments are carried out within the frequency range spanning from 1 MHz to 400 MHz. The objective is the development of fully functional electronic components, derived from discarded edible items, fostering sustainable practices, and finding applications in biomedicine.

Waste printed circuit boards (WPCBs) contain valuable material resources and hazardous substances, thereby posing a challenge for sustainable resource recovery and environmental protection initiatives. Overcoming this challenge will require mapping the toxic footprint of WPCBs to specific materials and substances used in manufacturing electronic components (ECs). Therefore, this work collected 50 EC specimens from WPCBs in five ubiquitous consumer products, such as television, refrigerator, air conditioner, washing machine and computer. The work extracted and analyzed metal contents and used leachability assessments based on tests adopted by the regulatory policies from China and the United States. The work found that copper and iron are the most abundant constituents in ECs, with concentrations ranging 5.90-796.62 g/kg and 0-831.53 g/kg, respectively; whereas abundance of precious metal content is in the order of silver > gold > palladium > platinum, with silver concentration ranging 15-5290 mg/kg. The content of marginally-regulated toxic substance arsenic ranged 0-9700 mg/kg; whereas fully regulated toxic metals such as chromium, lead and mercury did not exceed the thresholds set by China and US standards. The work found new toxic threats from arsenic and selenium leached from 20 of 50 ECs exceeding regulatory standards. These results will aid manufacturers and recyclers in protecting workers' health and environmental quality from arsenic and selenium pollution, and should initiate discussion about regulating these toxic components as part of a comprehensive program to reduce the toxic footprint of electronic products.

Meso-and microforming is a technology to shape parts from extremely small metal billets. Parts with geometric dimensions are a few millimetres to a few micrometres. With the rapid development of the electrical-electronics industry and biomedical engineering, the technology of forming microscopic parts has been researched and applied because of its efficiency, accuracy, and high productivity. Deep drawing is an operation that turns flat sheet metal blanks into hollow, open-mouth parts. It is an essential process in sheet metal stamping. Micro deep drawing is one of the micro-shaping technologies that has been widely studied and applied in recent years. However, the bases for calculating technological and geometrical parameters in the micro-deep drawing have not yet been analyzed and evaluated in detail. Therefore, this paper has proposed a theoretical basis combined with simulation applied to the design of technology to manufacture a connector head part drawing die with a diameter of 300µm and height of 1500µm using materials SUS304 material. Numerical simulation also allows evaluation of the stamping part's internal stress state, the ability to pull the workpiece into the die, and the thickness distribution on the product wall. Experimental research has also verified that, with the determined parameters, the stamping parts meet the quality requirements. This indicates the proposed calculation methods for the tiny deep drawing operation are entirely suitable. The results of this research can be wholly applied to the production of micro-sized cylindrical cup parts using the deep drawing method. [ABSTRACT FROM AUTHOR]

A cell phone detector is a device specifically designed to detect and locate the presence of a cell phone in a specific area. Cell phone detection has been studied for a long time. Techniques have been developed or proposed on how to detect cell phones. Most of them are trying to exploit features such as audio systems, RF systems, and common materials in phones and study how these can be used as the basis for cell phone detection. This study uses the cell phone's RF system as a function to detect the presence of a cell phone. Using relatively inexpensive and available electronic components, a circuit that detects signals in the 0.9 GHz to 3 GHz range is used to detect a mobile phone in use. The constructed cell phone detector can detect the presence of various activated cell phones within 1.5 meters around it and indicate this by flashing a light emitting diode (LED) connected to its output. Even if the cell phone is in silent mode. The circuit test results show that the cell phone detector works well. [ABSTRACT FROM AUTHOR]

The paper presents the results of experimental studies of the characteristics of a two-phase heat transmitting device (thermosyphon) that includes a flat copper evaporator with capillary grooves and a multipipe heat-exchanger–condenser intended for ensuring the temperature regime of powerful electronic and electrical devices. The capillary grooves of the evaporator can be coated with a layer of porous sintered copper powder. Heat removal from the thermosyphon condenser can be carried out by liquid or air flow. When using water as a coolant, the heat flux transmitted by the thermosyphon is more than 1 kW. [ABSTRACT FROM AUTHOR]

As a necessary part of all electronic devices, equipment and systems, electronic components play a vital role in the global economy. Since the corrosion of a single electronic component may directly affect the normal operation of the entire electronic system, the failure of electronic components has now become the most important cause of electrical system failure and has become a major obstacle to China's transformation into a scientific and technological power. Therefore, it is urgent to study the corrosion failure process of electronic components and the means of effective protection. In this paper, starting from the corrosion types and influencing factors of electronic components, especially chips, we introduce the influence of humidity, temperature, salt spray, and environmental particles, as well as the device's own surface roughness, material adhesion, semiconductor materials, metal coupling system, and lead-free solder system on corrosion performance in the environment. Subsequently, this paper summarizes how to protect electronic components during processing, and sums up the types of electronic component protections, and the specific corrosion protection process for the three commonly used types of chips, namely, the indium antimonide InSb chip, the IC chip, and the Sn–Zn solder chip, for reference. Finally, future development trends in the corrosion protection of electronic components are anticipated and summarized. [ABSTRACT FROM AUTHOR]

Copyright of Electronic Components & Materials is the property of Electronic Components & Materials and its content may not be copied or emailed to multiple sites or posted to a listserv without the copyright holder's express written permission. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract. (Copyright applies to all Abstracts.)

The rapid development of information technology has accelerated the application of big data and the Internet of Things in various industries. Big data has a great potential in the development of smart tourism. With the help of innovation in emerging technologies such as big data and Internet of Things, smart tourism has a better possibility to surpass traditional tourism. Therefore, this article provides a theoretical support to this process. It has explored the innovative management model of big data and IoT in smart tourism and evaluate their effects on promoting tourism. It offers a reference for the integration and innovation of the tourism theory system. Before big data technology, the development of Internet boosted online tourism. However, tourism marketing is still inefficient due to a lack of understanding about tourists. After many practical explorations of big data technology, tourism websites begin to adopt big data technology in their daily operations. With the changes in tourists' preferences and needs, further innovation and research are needed to help smart tourism keep up with the changes in the market and create more competitive products and services. Innovation serves as the driving force for enterprises to occupy the market and develop. [ABSTRACT FROM AUTHOR]

The present numerical study focuses on the cooling by natural convection and surface radiation of two electronic components generating two different and uniform volumetric powers. These components are modeled by two square bodies placed inside a closed square cavity with a cold straight wall. Two configurations are analyzed based on the position of the two heat‐generating bodies. In the first one (horizontal position configuration), the two bodies are located at the same height of the cavity, while they are placed at different heights in the second case (vertical position configuration). The effects of two Rayleigh numbers (0≤(Ra1,Ra2)≤106 $0\le ({{Ra}}_{1},{{Ra}}_{2})\le {10}^{6}$), the conductivity ratio (0.01≤K≤100 $0.01\le K\le 100$), and the emissivity (0≤ε≤1 $0\le \varepsilon \le 1$) on the heat transfer characteristics and the flow structure are analyzed. The data is displayed as streamlines, isotherms, velocity, and maximum temperature profiles, and local heat transfer on the active wall. The obtained results indicate that the choice of the appropriate configuration depends mainly on the deviation between the two Rayleigh numbers. Furthermore, the maximum temperature of a specific block decreases as the quantity of heat generated by the other block rises. We can also see that the maximum temperature of the two blocks decreases by about 50% $50 \% $ with the increase in the emissivity (from 0 $0$ to 1 $1$) or the conductivity ratio (from 0.1 $0.1$ to 1 $1$). [ABSTRACT FROM AUTHOR]

The study presents a bibliometric analysis of studies conducted on multi-materials printing of electronic components via additive manufacturing technologies. Using the R package and the associated biblioshiny, the study analyzed publications from Web of Science and Scopus. The study analyzed 405 research articles after removing 104 duplicates. The study applied performance analysis, keyword analysis, and network analysis. The performance analysis showed that the publications on multi-materials additive manufacturing are multi-disciplinary. Whilst the publications span almost three decades, most contributions started after 2015. The United States of America is the country with the highest production. The keyword analysis showed a changed focus before and after 2015. The trending topics show that the most recent trend is in the ‘aerospace industry’. Finally, the thematic analysis shows that the emerging themes in the area are interfaces, moisture, diffusion, microstructure, mechanical properties, and powder metallurgy. These emerging themes are discussed as they are conceived as the future directions of multi-materials printing of electronic components and devices. The current trend of research focuses on understanding and improving the interfacial bonding between the various multi-material interfaces. Overcoming the weak interfacial bonding issues would improve the mechanical properties of multi-materials electronic components.

The vulnerability of hearing aid devices to corrosion is critical due to their exposure to various kinds of ionic contaminants from the human body, such as sweat, sebum, and so forth, and harsh climatic conditions such as high temperature, humidity, and atmospheric pollutants. The device failure rate will vary depending upon the type of geographical location at which the device is used and root cause failure analysis is a crucial tool to understand the effect of geographical location on corrosion failures. In this study, field failed hearing aid devices from Europe, the United States, and Japan markets were investigated using a scanning electron microscope and elemental dispersive spectroscopy to locate failure mechanisms and causes. Information from the analysis was used for statistical analysis to compare the performance of the devices in the three markets based on failure percentage and failure probability for different parts and components. Solder terminals, battery contacts, light‐emitting diodes, and wireless‐link coil showed consistent and high failure probability across all three markets, whereas a higher failure rate for microphones was found in Europe and the United States market as compared to the Japanese market. The majority of the components corrosion failures occurred in the presence of high chloride ions from human sweat and the atmospheric conditions, whereas potassium hydroxide from the leakage of Zn–air battery was found as the additional cause for microphone failure. [ABSTRACT FROM AUTHOR]

Copyright of Chinese Journal of Refrigeration Technology is the property of Shanghai Society of Refrigeration and its content may not be copied or emailed to multiple sites or posted to a listserv without the copyright holder's express written permission. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract. (Copyright applies to all Abstracts.)

The present study is based on the numerical analysis of the thermal behavior around multilayers electronic component's interfaces. These components are increasingly miniaturized and receive constantly growing powers. These operating conditions cause serious thermal problems, which can lead to a progressive degradation of their performances and decrease their duration life. In multilayer electronic structures, this alteration is translated by delamination phenomenon in the interface contact regions. In order to detect damages on multilayers electronic components, we propose to follow the evolution of the thermal contact resistance between layers in the transient phase. To do this, we identify the thermal contact resistance by inverse heat conduction method from temperature measurements. [ABSTRACT FROM AUTHOR]

As a necessary part of all electronic devices, equipment and systems, electronic components play a vital role in the global economy. Since the corrosion of a single electronic component may directly affect the normal operation of the entire electronic system, the failure of electronic components has now become the most important cause of electrical system failure and has become a major obstacle to China’s transformation into a scientific and technological power. Therefore, it is urgent to study the corrosion failure process of electronic components and the means of effective protection. In this paper, starting from the corrosion types and influencing factors of electronic components, especially chips, we introduce the influence of humidity, temperature, salt spray, and environmental particles, as well as the device’s own surface roughness, material adhesion, semiconductor materials, metal coupling system, and lead-free solder system on corrosion performance in the environment. Subsequently, this paper summarizes how to protect electronic components during processing, and sums up the types of electronic component protections, and the specific corrosion protection process for the three commonly used types of chips, namely, the indium antimonide InSb chip, the IC chip, and the Sn–Zn solder chip, for reference. Finally, future development trends in the corrosion protection of electronic components are anticipated and summarized.