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A double gate JFETs are often used in analog integrated circuits to provide an extremely low input current and capacitance when the top gate is controlled. Circuit synthesis and modeling of analog IC with such a field-effect transistor are possible only if there are models that adequately describe the features of its operation, namely, changing of the current-voltage characteristics by the top gate controlling when a constant reverse voltage is applied to the bottom gate. The article considers the modernization of the well-known electrical model of the double gate field-effect transistor for the LTSpice software, which includes taking into account the influence of the top gate voltage by connecting two series-connected functional voltage sources to the top gate, one of which ensures the coincidence of the measurement results and the simulation of the drain current at a low voltage between the top gate and the source, and the second – when the voltage between the top gate and the source is close to the cutoff voltage. A method for identifying the parameters of functional voltage sources is presented. The proposed model of a double gate field-effect transistor is advisable to use in the IC design of various analog devices, especially electrometric operational amplifiers and charge-sensitive amplifiers.

One of directions of improving parameters of analog integrated circuits is a development of new and modernization of existing designs of integrated elements without significantly changing of a technological route of integrated circuit manufacturing with a simultaneous creation of new integrated elements models. The article considers the results of experimental studies of the double gate junction field-effect transistor manufactured according to the 3CBiT technological route of JSC Integral. Based on the obtained results, the electrical model of double gate junction field-effect transistor is proposed, which describes the features of its application in analog integrated circuits. Comparison of I-V characteristics of measurements results and created model simulation are presented. A small capacity and a reverse current of a double gate junction field-effect transistor top gate, an ability to compensate for the DC (direct current) component of an input current provide a significant improvement in the characteristics of analog integrated circuits such as electrometric operational amplifiers and charge-sensitive amplifiers. The developed double gate junction field-effect transistor can be used in signal readout devices required in the analog interfaces of space instrument sensors and nuclear electronics.

In this paper we present four simple analytical threshold voltage model for short- channel and length of saturation velocity region (LVSR) effect that takes into account the built - in potential of the source and drain channel junction, the surface potential and the surface electric field effect on double - gate graphene nanoribbon transistors. Four established models for surface potential, lateral electric field, LVSR and threshold voltage are presented. These models are based on the easy analytical solution of the two dimensional potential distribution in the graphene and Poisson equation which can be used to obtain surface potential, lateral electric field, LVSR and threshold voltage. These models give a closed form solution of the surface potential and electrical field distribution as a function of structural parameters and drain bias. Most of analytical outcomes are shown to correlate with outcomes acquired by Matlab simulation and the end model applicability to the published silicon base devices is demonstrated. [ABSTRACT FROM AUTHOR]

Abstract: In this paper, the concept of double gate transistors is applied to mechanically flexible amorphous indium–gallium–zinc-oxide (a-IGZO) thin film transistors (TFTs) fabricated on free standing plastic foil. Due to the temperature sensitivity of the plastic substrate, a-IGZO is a suitable semiconductor because it provides carrier mobilities around 10cm2/Vs when deposited at room temperature. Double gate TFTs with connected bottom and top gate are compared to bottom gate reference TFTs fabricated on the same substrate. Double gate a-IGZO TFTs exhibit a by 78% increased gate capacitance, a by 700mV higher threshold voltage, and therefore an up to 92% increased transconductance when characterized at the same gate voltage above threshold (over-bias voltage). The subthreshold swing and the on/off current ratios are improved as well, and reach excellent values of 69mV/dec and 2×109, respectively. The mechanical flexibility of double gate TFTs compared to bottom gate TTFs is investigated, and device operation is shown while the double gate TFT is exposed to tensile strain of 0.55%, induced by bending to a radius of 5mm. [Copyright &y& Elsevier]