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Background. The study of heat exchange processes in printed circuit assemblies is a fundamental problem for ensuring a high level of reliability and performance of electronic equipment and complex systems in general. Temperature control, obtaining reliable information about overheating temperatures of electronic components, identifying critically unstable elements and developing new technological methods for heat removal – these are the goals that can be achieved to ensure a high level of reliability of modern electronic equipment. Materials and methods. The relevance of the problem posed in the work is due to the widespread use in modern electronic equipment of microelectronic components that have direct contact with the surface of the printed circuit board, which in turn leads to a change in the nature of the temperature distribution, and in combination with the use of multilayer printed circuit boards, completely redefines the existing methods for studying and analyzing thermal processes in printing units. Results and conclusions. The work is aimed at studying heat transfer processes in printed circuit assemblies, and the scientific novelty lies in the development of a new method for predicting the reliability of electronic equipment by measuring and analyzing the thermal regime of printed circuit assemblies, taking into account not only the printed circuit board and components, but also the influence of the topology of printed conductors on its thermal regime , which together form a complex system for measurement and analysis.