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Integrated mid-infrared (MIR) photonics have various applications in optical fiber communication, spectral detection and identification, free-space communication, and light detection and ranging, etc. The MIR electro-optic (EO) modulator, which is one of the key components of MIR integrated photonic systems, has attracted a lot of research interests. In this paper, we review the reported integrated MIR EO modulators based on different modulation mechanisms and material platforms. The recent research progresses and challenges of MIR EO modulators are presented and discussed. The unique advantages and the corresponding applications of each type of MIR modulators are summarized as well. In the end, we provide our perspectives of a few areas in integrated MIR modulators that are worthy for research attention in future.

Metasurface holograms, with the capability to manipulate spatial light amplitudes and phases, are considered next-generation solutions for holographic imaging. However, conventional fabrication approaches for meta-atoms are heavily dependent on electron-beam lithography (EBL), a technique known for its expensive and time-consuming nature. In this paper, a polarization-insensitive metasurface hologram is proposed using a cost-effective and rapid nanoimprinting method with titanium dioxide (TiO2) nanoparticle loaded polymer (NLP). Based on a simulation, it has been found that, despite a reduction in the aspect ratio of meta-atoms of nearly 20%, which is beneficial to silicon master etching, NLP filling, and the mold release processes, imaging efficiency can go up to 54% at wavelength of 532 nm. In addition, it demonstrates acceptable imaging quality at wavelengths of 473 and 671 nm. Moreover, the influence of fabrication errors and nanoimprinting material degradation in terms of residual layer thickness, meta-atom loss or fracture, thermal-induced dimensional variation, non-uniform distribution of TiO2 particles, etc., on the performance is investigated. The simulation results indicate that the proposed device exhibits a high tolerance to these defects, proving its applicability and robustness in practice. [ABSTRACT FROM AUTHOR]

A metasurface is a layer of subwavelength-scale nanostructures that can be used to design functional devices in ultrathin form. Various metasurface-based optical devices – coined as flat optics devices – have been realized with distinction performances in research laboratories using electron beam lithography. To make such devices mass producible at low cost, metasurfaces over a large area have also been defined with lithography steppers and scanners, which are commonly used in semiconductor foundries. This work reviews the metasurface process platforms and functional devices fabricated using complementary metal-oxide-semiconductor-compatible mass manufacturing technologies. Taking both fine critical dimension and mass production into account, the platforms developed at the Institute of Microelectronics (IME), A*STAR using advanced 12-inch immersion lithography have been presented with details, including process flow and demonstrated optical functionalities. These developed platforms aim to drive the flat optics from lab to fab.

Metalenses made of artificial sub-wavelength nanostructures have shown the capability of light focusing and imaging with a miniaturized size. Here, we report the demonstration of mass-producible amorphous silicon metalenses on a 12-inch glass wafer via the complementary metal-oxide-semiconductor compatible process. The measured numerical aperture of the fabricated metalens is 0.496 with a focusing spot size of 1.26 μm at the wavelength of 940 nm. The metalens is applied in an imaging system to test the imaging resolution. The minimum bar of the resolution chart with a width of 2.19 μm is clearly observed. Furthermore, the same system demonstrates the imaging of a fingerprint, and proofs the concept of using metalens array to reduce the system size for future compact consumer electronics.

Half-wave plate (HWP) is one of the key polarization controlling devices in optical systems. The conventional HWPs based on birefringent crystals are inherently bulky and difficult to be monolithically integrated with other optical components. In this work, metasurface-based HWPs with high compactness are demonstrated on a 12-inch silicon complementary metal-oxide-semiconductor platform. Three-dimensional finite difference time domain simulation is used to design the nanostructure and investigate the impact of fabrication process variation on the device performance. In addition, the cross- and co-polarization transmittance (Tcross and Tco) of the HWPs located at different wafer locations are characterized experimentally. The peak Tcross and valley Tco values of 0.69 ± 0.053 and 0.032 ± 0.005 are realized at the wavelength around 1.7 μm, respectively. This corresponds to a polarization conversion efficiency of 95.6% ± 0.8%.

Purpose: By investigating the thermal-mechanical interaction between the through silicon via (TSV) and the Cu pad, this study aimed to determine the effect of electroplating defects on the upper surface protrusion and internal stress distribution of the TSV at various temperatures and to provide guidelines for the positioning of TSVs and the optimization of the electroplating process. Design/methodology/approach: A simplified model that consisted of a TSV (100 µm in diameter and 300 µm in height), a covering Cu pad (2 µm thick) and an internal drop-like electroplating defect (which had various dimensions and locations) was developed. The surface overall deformation and stress distribution of these models under various thermal conditions were analyzed and compared. Findings: The Cu pad could barely suppress the upper surface protrusion of the TSV if the temperature was below 250 ?. Interfacial delamination started at the collar of the TSV at about 250 ? and became increasingly pronounced at higher temperatures. The electroplating defect constantly experienced the highest level of strain and stress during the temperature increase, despite its geometry or location. But as its radius expanded or its distance to the upper surface increased, the overall deformation of the upper surface and the stress concentration at the collar of the TSV showed a downward trend. Originality/value: Previous studies have not examined the influence of the electroplating void on the thermal behavior of the TSV. However, with the proposed methodology, the strain and stress distribution of the TSV under different conditions in terms of temperature, dimension and location of the electroplating void were thoroughly investigated, which might be beneficial to the positioning of TSVs and the optimization of the electroplating process. [ABSTRACT FROM AUTHOR]

Metasurface-based beam deflector, as an important optical element to bend the light propagation direction, has drawn a lot of interests in research to achieve miniaturization of devices and reduction of system complexity. Based on the 12-inch immersion lithography technology, in this work, an ultra-thin and large-area pixelated metasurface beam deflector with a footprint of 2500 × 2500 μm, formed by nanopillars with diameters from 221 to 396 nm, is demonstrated on a 12-inch glass wafer. The 21 × 21 array of deflectors is designed to bend the input light in different directions and to generate 441 random points. In addition, the layer transfer on the 12-inch glass wafer makes the device working in transmission mode at a 940-nm wavelength. The random point array generated from the experiment shows good match with the design. This pixelated metasurface beam deflector can generate random points simultaneously and has potential to make beam steering by switching each pixel of the beam deflector, which can be applied on motion detection, facial recognition, and light detection and ranging.