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Resistive switching properties based on molecular beam epitaxy-grown monolayer hexagonal boron nitride (h-BN) atomristors are studied by using metal insulator metal configurations with different electrode materials. Au/monolayer h-BN/Ni devices demonstrate a forming-free bipolar resistive switching (BRS) behavior, a good endurance with up to 97 cycles at a high compliance current of 100 mA, an average on/off ratio of 103, and a low set/reset voltage variability. Metal/monolayer h-BN/graphite/Co devices exhibit self-compliant current BRS characteristics. Both metal/h-BN/Ni and metal/h-BN/graphite/Co devices show the coexistence of BRS, unipolar resistive switching (URS), and nonvolatile threshold switching (TH) modes. The formation of conductive filaments is attributed to the diffusion and trapping of metal ions on the defect sites driven by the electric field, while the rupture is driven by the electric field in BRS and by Joule heating in URS and TH modes.

Two-dimensional (2D) hexagonal boron nitride (h-BN) plays a significant role in nanoscale electrical and optical devices because of its superior properties. However, the difficulties in the controllable growth of high-quality films hinder its applications. One of the crucial factors that influence the quality of the films obtained via epitaxy is the substrate property. Here, we report a study of 2D h-BN growth on carburized Ni substrates using molecular beam epitaxy. It was found that the carburization of Ni substrates with different surface orientations leads to different kinetics of h-BN growth. While the carburization of Ni(100) enhances the h-BN growth, the speed of the h-BN growth on carburized Ni(111) reduces. As-grown continuous single-layer h-BN films are used to fabricate Ni/h-BN/Ni metal-insulator-metal (MIM) devices, which demonstrate a high breakdown electric field of 12.9 MV/cm.

Direct tunneling and dielectric breakdown in molecular beam epitaxial hexagonal boron nitride (h-BN) monolayers were studied based on Ni/h-BN/Ni metal-insulator-metal (MIM) device structures. Effec...

The effects of the addition of rice husk ash (RHA) on the mechanical and microstructural properties of an ultra-high performance cement-based composite (UHPCC) was studied. The microstructure of the UHPCC was investigated using X-ray diffraction, mercury intrusion porosimetry, scanning electron microscopy and other analytical test methods. The results showed that the mechanical performance was improved with the addition of RHA. Mortars blended with 15% RHA showed the highest compressive and flexural strengths. For mortars reinforced with 3% steel fibres by volume, both flexural and compressive strengths were remarkably enhanced. The optimal content of RHA was found to be about 10–15%. The addition of RHA decreased the hydration heat evolution rate of the cementitious composites, but the hydration process was brought forward due to the addition of RHA. As a result of calcium hydroxide consumption through the pozzolanic reaction of the RHA, the interface was strengthened with an increase in curing time and the microstructure of the mortar containing RHA blended was denser than that of mortar without RHA. The high pozzolanic reaction and the filler effect of RHA contributed to a finer pore structure and a decrease in porosity.

Reliable and controllable synthesis of two-dimensional (2D) hexagonal boron nitride (h-BN) layers is highly desirable for their applications as 2D dielectric and wide bandgap semiconductors. In this work, we demonstrate that the dissolution of carbon into cobalt (Co) and nickel (Ni) substrates can facilitate the growth of h-BN and attain large-area 2D homogeneity. The morphology of the h-BN film can be controlled from 2D layer-plus-3D islands to homogeneous 2D few-layers by tuning the carbon interstitial concentration in the Co substrate through a carburization process prior to the h-BN growth step. Comprehensive characterizations were performed to evaluate structural, electrical, optical, and dielectric properties of these samples. Single-crystal h-BN flakes with an edge length of ∼600 μm were demonstrated on carburized Ni. An average breakdown electric field of 9 MV/cm was achieved for an as-grown continuous 3-layer h-BN on carburized Co. Density functional theory calculations reveal that the interstitial carbon atoms can increase the adsorption energy of B and N atoms on the Co(111) surface and decrease the diffusion activation energy and, in turn, promote the nucleation and growth of 2D h-BN.

Controllable wafer-scale growth is one of the ultimate goals in two-dimensional (2D) h-BN synthesis, which is not fully accomplished to date. One of critical issues is the formation of three-dimensional (3D) islands (adlayers) within 2D layers, thus the films are non-uniform in thickness. In this paper, we present a study of h-BN adlayer growth and provide a strategy towards eliminating these adlayers for the precise control of the number of 2D layers. By varying the growth parameters such as substrate property, nitrogen source composition, and substrate carburization time, we found that the adlayer growth can be controlled by controlling the nucleation and intercalation processes, which is achieved by engineering the defects and impurities on substrate and the activeness of the h-BN edges. While crystallographic defects and impurities stimulate the multilayer nucleation process, activated edge tends to turn off the intercalation process by reducing the probability of precursors penetrating into the interface. We have achieved the growth of a large-area adlayer-free single-layer h-BN film.

We carried out a systematic study of hexagonal boron nitride/graphene (h-BN/G) heterostructure growth by introducing high incorporation of a carbon (C) source on a heated cobalt (Co) foil substrate followed by boron and nitrogen sources in a molecular beam epitaxy system. With the increase of C incorporation in Co, three distinct regions of h-BN/G heterostructures were observed from region (1) where the C saturation was not attained at the growth temperature (900 °C) and G was grown only by precipitation during the cooling process to form a 'G network' underneath the h-BN film; to region (2) where the Co substrate was just saturated by C atoms at the growth temperature and a part of G growth occurs isothermally to form G islands and another part by precipitation, resulting in a non-uniform h-BN/G film; and to region (3) where a continuous layered G structure was formed at the growth temperature and precipitated C atoms added additional G layers to the system, leading to a uniform h-BN/G film. It is also found that in all three h-BN/G heterostructure growth regions, a 3 h h-BN growth at 900 °C led to h-BN film with a thickness of 1-2 nm, regardless of the underneath G layers' thickness or morphology. Growth time and growth temperature effects have been also studied.