1. Enhanced damping and thermal conductivity of hBN/silicone rubber composites via strong interfacial action
- Author
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Fengmei Ren, Zizheng Yang, Haihong Ma, Zhengfa Zhou, and Weibing Xu
- Subjects
hexagonal boron nitride ,damping ,thermal conductivity ,silicone rubber composites ,Materials of engineering and construction. Mechanics of materials ,TA401-492 ,Chemical technology ,TP1-1185 - Abstract
High integration and miniaturization of electronic systems require thermal conductivity and mechanical damping materials. In this study, hexagonal boron nitride ( h BN) particles were modified by vinyltrimethoxysilane (V171) and hexadecyltrimethoxysilane (N3116) for comparing, and described as V171- h BN and N3116- h BN, respectively. The pristine and surface modified h BN were filled in vinylmethylpolysiloxane (VMQ), and then vulcanized to fabricate h BN/silicone rubber composites. The damping properties of V171- h BN/silicone rubber composites were significantly higher than that of pristine h BN/silicone rubber composites, while N3116- h BN/silicone rubber composites were in contrast. The strong interfacial action in V171- h BN/silicone rubber composites came from the chemical bond by vinyl groups on the surface of V171- h BN taking part in the vulcanization of VMQ. This strong interfacial action led the deformation of h BN, and the internal friction between layers of h BN significantly increased to dissipate more energy. As a result, V171- h BN/silicone rubber composites with excellent damping and thermal conductivity as well as good mechanical properties were obtained.
- Published
- 2022
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