221 results on '"Zhao, Dewen"'
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2. Strategies of realizing NO2 detections with enhanced selectivity and anti-humidity based on snowflake-like in-situ grown ZIF-8/ZnOHF composites
3. Mesoporous CoxWO4-sensing platform toward ethanol detection
4. Cutting speed dependence of material removal mechanism for monocrystal silicon
5. Prediction and measurement for grinding force in wafer self-rotational grinding
6. Ductile deformation and subsurface damage evolution mechanism of silicon wafer induced by ultra-precision grinding process
7. Effects of grinding-induced surface topography on the material removal mechanism of silicon chemical mechanical polishing
8. Influence of anisotropy on material removal and deformation mechanism based on nanoscratch tests of monocrystal silicon
9. Novel analytical heat source model for cold rolling based on an energy method and unified yield criterion
10. Atomic-scale study on particle movement mechanism during silicon substrate cleaning using ReaxFF MD
11. Effects of wheel spindle vibration on surface formation in wafer self-rotational grinding process
12. Undeformed chip width non-uniformity modeling and surface roughness prediction in wafer self-rotational grinding process
13. The material removal and surface generation mechanism in ultra-precision grinding of silicon wafers
14. Optimization solution of vertical rolling force using unified yield criterion
15. All-Solution-Processed Electronics with Sub-Microscale Resolution and Nanoscale Fidelity Fabricated Via a Humidity-Controlled, Surface Energy-Directed Assembly Process.
16. NO 2 -Sensitive SnO 2 Nanoparticles Prepared Using a Freeze-Drying Method.
17. Flatness maintenance and roughness reduction of silicon mirror in chemical mechanical polishing process
18. Numerical investigation of wafer drying induced by the thermal Marangoni effect
19. Fabrication of Flexible and Transparent Metal Mesh Electrodes Using Surface Energy‐Directed Assembly Process for Touch Screen Panels and Heaters
20. Cutting speed dependence of material removal mechanism for monocrystal silicon
21. Prediction of Pad Wear Profile and Simulation of Its Influence on Wafer Polishing
22. Kinetics Modelling of Isothermal Bainite Transformation in Low Carbon Multi-Microalloyed Steel
23. Analysis of Hot Rolling with Simplified Weighted Velocity Field and My Criterion
24. Comparative study of the lubricating behavior between 12-in. copper disk and wafer during chemical mechanical polishing
25. Surface figure control in fine rotation grinding process of thick silicon mirror
26. Hydrodynamic Investigation of Ultraclean Wafer Drying Combining Marangoni Effect and Centrifugal Force
27. Hydrogen permeation behavior in relation to microstructural evolution of low carbon bainitic steel weldments
28. Influence of microstructural aspects on impact toughness of multi-pass submerged arc welded HSLA steel joints
29. Microstructure, Composition, and Impact Toughness Across the Fusion Line of High-Strength Bainitic Steel Weldments
30. Application of parabolic velocity field for the deformation analysis in hot tandem rolling
31. Analysis of edge rolling based on continuous symmetric parabola curves
32. Mechanism Analysis of Megasonic and Brush Cleaning Processes for Silicon Substrate after Chemical Mechanical Polishing
33. Analysis of plate rolling by MY criterion and global weighted velocity field
34. Limit analysis based on GM criterion for defect-free pipe elbow under internal pressure
35. The calculation of vertical rolling force by using angular bisector yield criterion and Pavlov principle
36. Optimization of design of experiment for chemical mechanical polishing of a 12-inch wafer
37. Wafer bending/orientation characterization and their effects on fluid lubrication during chemical mechanical polishing
38. In-situ measurement of Cu film thickness during the CMP process by using eddy current method alone
39. Effect of zone pressure on wafer bending and fluid lubrication behavior during multi-zone CMP process
40. Analysis of microstructural variation and mechanical behaviors in submerged arc welded joint of high strength low carbon bainitic steel
41. An Investigation on the Total Thickness Variation Control and Optimization in the Wafer Backside Grinding Process
42. A novel analytical heat source model for cold rolling based on the energy method and unified yield criterion
43. Microstructural characteristics and toughness of the simulated coarse grained heat affected zone of high strength low carbon bainitic steel
44. Mechanism Analyses of Megasonic and Brush on Post Si Cmp Cleaning Process
45. A kinematic model describing particle movement near a surface as effected by Brownian motion and electrostatic and Van der Waals forces
46. Deduction of geometrical approximation yield criterion and its application
47. Effect of Ti-enriched Carbonitride on Microstructure and Mechanical Properties of X80 Pipeline Steel
48. Optimization solution of vertical rolling force using unified yield criterion
49. Analysis of deformations of rolls in the six-high tandem mill on the basis of anti-symmetry rotation
50. Chemical mechanical polishing: Theory and experiment
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