18 results on '"Yin, Youkang"'
Search Results
2. A review on surface texturing of zirconia ceramics for dental applications
3. Study on thermal damage formation mechanisms and surface integrity in creep-feed profile grinding of superalloys
4. A critical review on sintering and mechanical processing of 3Y-TZP ceramics
5. On crack suppression mechanisms of ultrasonic elliptical vibration cutting of 3Y-TZP ceramics
6. A critical review addressing drilling-induced damage of CFRP composites
7. Analysis of Grindability and Surface Integrity in Creep−Feed Grinding of High−Strength Steels
8. Sawing characteristics of diamond wire cutting sapphire crystal based on tool life cycle
9. Fracture strength of photovoltaic silicon wafers cut by diamond wire saw based on half-penny crack system
10. Analysis of crack-free surface generation of photovoltaic polysilicon wafer cut by diamond wire saw
11. Hydrodynamic action in slicing PV polysilicon with a novel fixed and free abrasive combined wire sawing
12. Study on cutting PV polysilicon with a new type of diamond abrasives-helix-distribution saw wire based on controlling the subsurface microcrack damage depth
13. Experimental investigation on the machining characteristics of fixed-free abrasive combined wire sawing PV polycrystalline silicon solar cell
14. Analysis of Grindability and Surface Integrity in Creep-Feed Grinding of High-Strength Steels.
15. Analytical prediction of subsurface microcrack damage depth in diamond wire sawing silicon crystal
16. Experimental study on slicing photovoltaic polycrystalline silicon with diamond wire saw
17. Experiment and theoretical prediction for surface roughness of PV polycrystalline silicon wafer in electroplated diamond wire sawing
18. Study on finite element simulation and experiment based on the design of zero-point clamping system
Catalog
Books, media, physical & digital resources
Discovery Service for Jio Institute Digital Library
For full access to our library's resources, please sign in.