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2. Optimization of Stamping Process Parameters for Small Curved Beam Parts of Rail Train Based on GA-PSO-BP Algorithm

12. Multiphysics Model Reconstruction Method of PP-IGBT and Stress Distribution Influencing Factors

13. Reliability Lifetime Prediction of SiC IGBT Devices with Different Packaging Approaches

14. Multi-physical Finite Element Modeling and Influencing Factor Analysis for Solder Layer Failure of SiC MOSFET Device

17. Analysis of landslide mechanism induced by excavation and rainfall: A case study of the Qianjin square landslide in Wanyuan City, Sichuan Province

29. Analysis on the Package Failure Modes and Condition Monitoring Methods of Wire-Bond IGBT

37. Study on antioxidant activities of proteins and enzymatic hydrolysates of eight edible fungi

38. Improving Short-Circuit Withstand Capability by Targeted Optimization Package for Press-Pack IGBT Module

40. Structural Characterization of Polysaccharides in Waste Liquor Produced by Wet Decortication of Sesame Seeds

41. High-quality β-(AlxGa1−x)2O3 thin films on sapphire substrates by face-to-face annealing.

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