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2. Optimization of Stamping Process Parameters for Small Curved Beam Parts of Rail Train Based on GA-PSO-BP Algorithm

11. Multiphysics Model Reconstruction Method of PP-IGBT and Stress Distribution Influencing Factors

12. Reliability Lifetime Prediction of SiC IGBT Devices with Different Packaging Approaches

13. Multi-physical Finite Element Modeling and Influencing Factor Analysis for Solder Layer Failure of SiC MOSFET Device

19. Analysis of landslide mechanism induced by excavation and rainfall: A case study of the Qianjin square landslide in Wanyuan City, Sichuan Province

31. Analysis on the Package Failure Modes and Condition Monitoring Methods of Wire-Bond IGBT

38. Study on antioxidant activities of proteins and enzymatic hydrolysates of eight edible fungi

40. Improving Short-Circuit Withstand Capability by Targeted Optimization Package for Press-Pack IGBT Module

42. Structural Characterization of Polysaccharides in Waste Liquor Produced by Wet Decortication of Sesame Seeds

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