37 results on '"Yang, Yusin"'
Search Results
2. Non-contact measurement of dopant depth profile with terahertz emission spectroscopy
3. E-beam simulation for advanced SEM applications in semiconductor industry
4. In-fab assessment of heat budget in 3D NAND flash devices using terahertz wave-based metrology system
5. E-beam simulation for advanced SEM applications in semiconductor industry
6. Wide-field massive CD metrology based on the imaging Mueller-matrix ellipsometry for semiconductor devices
7. Mueller matrix metrology with multi-angle information using multiple self-interference
8. Massive overlay metrology solution by realizing imaging Mueller matrix spectroscopic ellipsometry
9. A study on defect signal improvement using multi-scan optic patch images and new detection algorithm
10. Fourier ptychographic topography
11. Wide-field, high-resolution reflection-mode Fourier ptychographic microscopy
12. Supplementary document for Fourier ptychographic topography - 6327248.pdf
13. Semiconductor Technology Challenges in High Volume Manufacturing of Semiconductors
14. A study on the detection and monitoring of weak areas in wafer using massive 2D and 3D measurement data
15. Wide-field massive CD metrology based on the imaging Mueller-matrix ellipsometry for semiconductor devices
16. A study on defect signal improvement using multi-scan optic patch images and new detection algorithm
17. Massive overlay metrology solution by realizing imaging Mueller matrix spectroscopic ellipsometry
18. The novel feature based inspection technique that can detect defects that can affect the deterioration of the electrical properties of semiconductor devices
19. Angstrom-accuracy multilayer thickness determination using optical metrology and machine learning
20. Non-destructive thickness characterisation of 3D multilayer semiconductor devices using optical spectral measurements and machine learning
21. Non-contact measurement of dopant depth profile with terahertz emission spectroscopy
22. Spectroscopic vector analysis for fast pattern quality monitoring
23. Angstrom-accuracy multilayer thickness determination using optical metrology and machine learning
24. A new method for wafer quality monitoring using semiconductor process big data
25. Characterization of interface charge traps in PE-TEOS and HDP oxide with different annealing temperatures using time-dependent second-harmonic generation.
26. Spectroscopic vector analysis for fast pattern quality monitoring
27. A study of the defect detection technology using the optic simulation for the semiconductor device
28. Fast, exact and non-destructive diagnoses of contact failures in nano-scale semiconductor device using conductive AFM
29. A study of optical penetration into the micro-periodic structure of semiconductor devices
30. A new method for wafer quality monitoring using semiconductor process big data
31. Characterization of interface charge traps in PE-TEOS and HDP oxide with different annealing temperatures using time-dependent second-harmonic generation
32. Mueller matrix metrology with multi-angle information using multiple self-interference
33. Quasi-Phase-Matching Structures induced by Ferroelastic Domains in RbTiOAsO4 Crystals
34. A study on the detection and monitoring of weak areas in wafer using massive 2D and 3D measurement data.
35. Dielectric properties of RbTiOAsO4 single crystals
36. A study on the detection and monitoring of weak areas in wafer using massive 2D and 3D measurement data
37. A study of the defect detection technology using the optic simulation for the semiconductor device
Catalog
Books, media, physical & digital resources
Discovery Service for Jio Institute Digital Library
For full access to our library's resources, please sign in.