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The total ionizing dose (TID) effect of gamma-ray (γ-ray) irradiation on HfOx based resistive random access memory was investigated by electrical and material characterizations. The memory states can sustain TID level ~5.2 Mrad (HfO2) without significant change in the functionality or the switching characteristics under pulse cycling. However, the stability of the filament is weakened after irradiation as memory states are more vulnerable to flipping under the electrical stress. X-ray photoelectron spectroscopy was performed to ascertain the physical mechanism of the stability degradation, which is attributed to the Hf-O bond breaking by the high-energy γ-ray exposure. [ABSTRACT FROM AUTHOR]

A review of the ionizing radiation effects on resistive random access memory (ReRAM) technology and devices is presented in this article. The review focuses on vertical devices exhibiting bipolar resistance switching, devices that have already exhibited interesting properties and characteristics for memory applications and, in particular, for non-volatile memory applications. Non-volatile memories are important devices for any type of electronic and embedded system, as they are for space applications. In such applications, specific environmental issues related to the existence of cosmic rays and Van Allen radiation belts around the Earth contribute to specific failure mechanisms related to the energy deposition induced by such ionizing radiation. Such effects are important in non-volatile memory as the current leading technology, i.e. flash-based technology, is sensitive to the total ionizing dose (TID) and single-event effects. New technologies such as ReRAM, if competing with or complementing the existing non-volatile area of memories from the point of view of performance, also have to exhibit great reliability for use in radiation environments such as space. This has driven research on the radiation effects of such ReRAM technology, on both the conductive-bridge RAM as well as the valence-change memories, or OxRAM variants of the technology. Initial characterizations of ReRAM technology showed a high degree of resilience to TID, developing researchers’ interest in characterizing such resilience as well as investigating the cause of such behavior. The state of the art of such research is reviewed in this article. [ABSTRACT FROM AUTHOR]

In this work, the resistance plasticity of Cu/SiO2/W programmable metallization cell devices is experimentally explored for the emulation of biological synapses. PMC devices were fabricated with foundry friendly materials using standard processes. The resistance can be continuously increased or decreased with both dc and voltage pulse programming. Impedance spectroscopy results indicate that the gradual change of resistance is attributable to the expansion or contraction of a Cu-rich layer within the device. Pulse programming experiments further show that the pulse amplitude plays a more important role in resistance change than pulse width, which is consistent with the proposed ‘dual-layer’ device model. The dense resistance-state distribution, 1 V operating voltage and inherent CMOS-compatibility suggests its potential application as electronic synapse in neuromorphic computing. [ABSTRACT FROM AUTHOR]