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The semiconductor industry widely exploits bin wafer maps and their spatial information for process monitoring and yield enhancement. However, the bin wafer maps' underlying parameters are even more sensitive and informative. In this article, I describe the design of an interactive wafer map visualization tool and its implementation using Tcl/Tk. More importantly, I demonstrate how one could use the resulting color wafer maps to uncover subtle manufacturing process patterns, variations and trends that are otherwise extremely difficult to detect and discover.

Power efficiency is one of the most critical factors for wireless sensor networks. In this paper, we present a family of receiver-initiated pseudo-asynchronous rendezvous schemes designed specifically to reduce sensor nodes' power consumption. We analyze their performances in terms of power efficiency and latency, under different static and dynamic system parameters. In addition, we verify our analysis by extensive network simulations. Based on the results, our proposed scheme demonstrates superior performance compared to previous proposed schemes

We propose two generic rendez-vous schemes for dense wireless sensor networks, including the transmitter- and receiver-initiated cycled receiver schemes. Our studies include the analyses and comparisons of their power efficiencies, especially under a fading channel as a realistic physical layer. We believe our modeling strategies as well as the results are applicable to any rendez-vous scheme of the cycled- receiver nature. The paper further proposes precise guidelines and optimization strategies for synchronization in wireless sensor networks.