340 results on '"Wunderle, B."'
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2. Thermo-mechanical-optical coupling within a digital twin development for automotive LiDAR
3. Determination of Temperature Dependent Young’s Modulus of Sintered Silver (SAG) by Vibration Tests
4. Full-Field Through-Chip IR-Thermography-based Quality Testing & Failure Analysis on Electroplated Aluminium Interconnects for Cryogenic Applications in Ion-Trap Quantum Computers
5. Tilt- and warpage measurement as inline quality assessment tool
6. Nanomechanics of CNTs for Sensor Application
7. Characterization of Thermal Interface Materials to Support Thermal Simulation
8. Failure Analysis of Sintered Layers in Power Modules Using Laser Lock-in Thermography
9. Characterization and simulation of delamination on package-level considering sub-critical interfacial fracture-parameters under cyclic loading.
10. MEMS Cantilever on High-Cycle Fatigue Testing of thin Metal Films
11. Temperature Moisture and Mode Mixity Dependent EMC- Copper (Oxide) Interfacial Toughness
12. High-Cycle Fatigue Testing of thin Metal Films on MEMS Cantilever
13. Inline Tilt Measurements of Sintered Dies by Optical Line Scanning as Quality Assessment Tool for Smart Production
14. Inline Failure Analysis of Sintered Layers in Power Modules using Infrared Thermography
15. Structural-Thermal-Optical-Performance (STOP) Analysis of a Lens Stack for Realization of a Digital Twin of an automotive LiDAR
16. Characterization of interfacial parameters for lifetime modelling in modern optical sensor package assemblies
17. Nanomechanical characterization of Sn–Ag–Cu/Cu joints—Part 2: Nanoindentation creep and its relationship with uniaxial creep as a function of temperature
18. On the development of a modified button shear specimen to characterize the mixed mode delamination toughness
19. Laser Lock-in Thermography for Inspection of Silver-Sintered Die Attaches
20. Infrared thermal imaging as inline quality assessment tool
21. Thermo-mechanical-optical coupling within a digital twin development for automotive LiDAR
22. Using AFM Measurements for Failure Indication During High-Cycle Fatigue Testing of thin Metal Films on MEMS Cantilevers
23. Tilt- and warpage measurement of bonded dies as an inline quality assessment tool
24. Finite element-based lifetime modelling of SAC solder joints in LED applications
25. Simulations for nanoindentation on thin metal films and the potential influence of creep
26. Dynamical characterisation of a miniaturised bulge tester for use at elevated temperatures
27. Failure modeling of ACA-glued flip-chip on flex assemblies
28. Application of interfacial fracture mechanics approach for obtaining design rules for flip chip interconnections
29. Interlayer cooling potential in vertically integrated packages
30. Nondestructive failure analysis and simulation of encapsulated 0402 multilayer ceramic chip capacitors under thermal and mechanical loading
31. Modular parametric finite element modelling for reliability-studies in electronic and mems packaging
32. Temperature Moisture and Mode Mixity Dependent EMC- Copper (Oxide) Interfacial Toughness
33. Progress in reliability research in the micro and nano region
34. Thermal Characterisation and Failure Analysis of MMIC Components by Thermo-Reflectance Imaging
35. Pulsed Infrared Thermography Failure Analysis of Low-emissivity Specimens Without Contaminations Caused by High-emissivity Coatings
36. Nanoindentation as part of material characterization of thin metal films
37. Residual Stress Characterisation of Thin Sputtered Copper Films on Silicon Exploiting Membrane Resonance within a Specimen Centred Approach
38. Inspection of silver-sinter die attaches by pulsed and lock-in infrared thermography with flash lamp and laser excitation
39. Carbon nanotubes for mechanical sensor applications
40. Advanced characterization methods for electrical and sensoric components and devices at the micro and nanoscale
41. Highly Miniaturized MEMS‐Based Test Platforms for Thermo‐Mechanical and Reliability Characterization of Nano‐Functional Elements - Technology and Functional Test Results
42. Parametric FE-approach to flip-chip reliability under various loading conditions
43. Button Shear Fatigue Test: Fracture-Mechanical Interface Characterisation under Periodic Subcritical Mechanical Loading
44. Time-Dependent Behaviour of Bonded Silicon Dies under Subcritical, Constant Shear Loading
45. Advanced Mixed-Mode Bending Test: Influence of the Surface Topography on the Fracture Behavior of an EMC to Copper Lead Frame Bi-Material Interface
46. Accelerated Pump Out Testing for Thermal Greases
47. Quantitative in-situ scanning electron microscope pull-out experiments and molecular dynamics simulations of carbon nanotubes embedded in palladium.
48. Transient thermal storage of excess heat using eutectic BiSn as phase change material for the thermal management of an electronic power module: design, technology, performance and reliability within a system approach
49. A Novel Concept for Accelerated Stress Testing of Thermal Greases and In-situ Observation of Thermal Contact Degradation
50. Characterization of EMC/LF interfacial fracture toughness using the advanced mixed-mode bending method
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