1. Beam test of a 180 nm CMOS Pixel Sensor for the CEPC vertex detector.
- Author
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Wu, Tianya, Li, Shuqi, Wang, Wei, Zhou, Jia, Yan, Ziyue, Hu, Yiming, Zhang, Xiaoxu, Liang, Zhijun, Wei, Wei, Zhang, Ying, Wei, Xiaomin, Huang, Xinhui, Zhang, Lei, Qi, Ming, Zeng, Hao, Jia, Xuewei, Hu, Jun, Fu, Jinyu, Zhang, Hongyu, and Li, Gang
- Subjects
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VERTEX detectors , *SPATIAL resolution , *PIXELS , *DETECTORS , *COLUMNS , *ACQUISITION of data - Abstract
The proposed Circular Electron Positron Collider (CEPC) imposes new challenges for the vertex detector in terms of pixel size and material budget. A Monolithic Active Pixel Sensor (MAPS) prototype called TaichuPix, based on a column drain readout architecture, has been developed to address the need for high spatial resolution. In order to evaluate the performance of the TaichuPix-3 chips, a beam test was carried out at DESY II TB21 in December 2022. Meanwhile, the Data Acquisition (DAQ) for a multi-plane configuration was tested during the beam test. This work presents the characterization of the TaichuPix-3 chips with two different processes, including cluster size, spatial resolution, and detection efficiency. The analysis results indicate the spatial resolution better than 5 µm and the detection efficiency exceeding 99.5 % for TaichuPix-3 chips with the two different processes. [ABSTRACT FROM AUTHOR]
- Published
- 2024
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