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146 results on '"Wu, Chih-Chiang"'

12. Power Receiving Unit for High-Power Resonant Wireless Power Transfer.

Author

Liu, Ching-Yao, Tang, Hsien-Chung, Shieh, Yueh-Tsung, Wu, Chih-Chiang, Chieng, Wei-Hua, Chang, Edward-Yi, and Ueda, Daisuke

Subjects
WIRELESS power transmission, ELECTRIC power, TRANSISTORS, ELECTRIC charge
Abstract

A new power receiving unit (PRU) is proposed in this paper for resonant wireless power transfer (WPT), which is characterized by the capability of attracting high power from the power transmitting unit (PTU). The resonant WPT is designed for delivering the electrical power to the PRU attached on an electrical vehicle (EV) chassis 50 cm away from a PTU installed on the ground. The proposed PRU uses only the passive elements such as inductors, diodes, and capacitors, which need no initial power from the EV. It is then applicable for charging a battery to several hundred volts for even a first-time charging battery. For a resonant WPT at a switching frequency of 4 MHz, the proposed PRU behaves as a negative impedance converter (NIC) itself in the subharmonics of 4 MHz. The NIC effect plus the subharmonic oscillation causes an instability current charging the battery connected to the PRU. In this paper, we simulated the PRU and performed the experiment. The experiment demonstrated a battery charging of 150 W from 50 cm away using three D-mode GaN HEMT transistors via the instability current ramp. The power transfer efficiency (PTE) improved as the power delivered to the load (PDL) increased. The peak PTE was 65% in the present findings. The simulation analysis showed that the circuit allowed itself be used to much higher power transfer when it is implemented with more GaN HEMT transistors connected in parallel. The theoretical derivation of the PRU circuit is also used to support both the experimental and simulation results. [ABSTRACT FROM AUTHOR]

Published
2023
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16. Smart Architecture for High-Speed Intrusion Detection and Prevention Systems

Author

Wu, Chih-Chiang, Wen, Sung-Hua, Huang, Nen-Fu, Hutchison, David, editor, Kanade, Takeo, editor, Kittler, Josef, editor, Kleinberg, Jon M., editor, Mattern, Friedemann, editor, Mitchell, John C., editor, Naor, Moni, editor, Nierstrasz, Oscar, editor, Pandu Rangan, C., editor, Steffen, Bernhard, editor, Sudan, Madhu, editor, Terzopoulos, Demetri, editor, Tygar, Dough, editor, Vardi, Moshe Y., editor, Weikum, Gerhard, editor, Pointcheval, David, editor, Mu, Yi, editor, and Chen, Kefei, editor

Published
2006
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18. 10‐1: Layout of 1.50‐inch, 3207‐ppi OLED Display with OSLSI/SiLSI Structure Capable of Division Driving Fabricated through VLSI Process with Side‐by‐Side Patterning by Photolithography

Author

Saito, Toshihiko, primary, Mizuguchi, Toshiki, additional, Okamoto, Yuki, additional, Ito, Minato, additional, Toyotaka, Kouhei, additional, Kozuma, Munehiro, additional, Matsuzaki, Takanori, additional, Kobayashi, Hidetomo, additional, Onuki, Tatsuya, additional, Hiura, Yoshikazu, additional, Hodo, Ryota, additional, Sasagawa, Shinya, additional, Kunitake, Hitoshi, additional, Nakamura, Daiki, additional, Sato, Hitomi, additional, Kimura, Hajime, additional, Wu, Chih-Chiang, additional, Yoshida, Hiroshi, additional, Chen, Min-Cheng, additional, Liao, Ming-Han, additional, Chang, Shou-Zen, additional, and Yamazaki, Shunpei, additional

Published
2022
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38. Minimizing Power Module Size with Low Stray Inductance and High Heat Dissipation

Author

Wu Chih-Chiang, Hsieh Shih-Kai, Ho Cheng-Han, Lin Li-Song, and Ming-Tsan Peng

Subjects
Wire bonding, Materials science, Mechanical engineering, Hardware_PERFORMANCEANDRELIABILITY, Dissipation, Power (physics), chemistry.chemical_compound, chemistry, Power module, Parasitic element, Hardware_INTEGRATEDCIRCUITS, Silicon carbide, Commutation, Current density
Abstract

Parasitic inductance and heat dissipation are crucial in power module design. This study attempted to minimize the size of a silicon carbide module while maintaining high power output capacity and low parasitic inductance. The discussion herein describes the derivation of the basic specifications, wire bonding analysis, current density analysis, and calculations of the currents for parallel-connected power chips, stray inductance of the commutation loop, thermal stress, and the temperature of each layer of the module. The commutation loop inductance and current density of the power module were modeled and estimated in ANSYS Q3D Extractor, and the thermal stress and module layer temperature were analyzed in Abaqus and ANSYS Icepak respectively. The analysis results indicate that the module can achieve high power output with minimal parallel chips, and the thermal stress and fatigue life meet the requirements.

Published
2019

40. The role of asymmetry and dynamics in carry trade and general financial markets.

Author

Wu, Chang‐Che, Huang, MeiChi, and Wu, Chih‐Chiang

Subjects
FINANCIAL markets, GLOBAL Financial Crisis, 2008-2009, MARKET timing, STOCK prices, INVESTORS
Abstract

This study investigates asymmetric dependence and its dynamics across returns to carry trades, stocks, and bonds using a copula‐based model. We show evidence for a significant increase in carry trade‐stock dependence and substantially negative carry trade‐bond and stock‐bond comovements since the 2007–2008 global financial crisis. We also assess the out‐of‐sample predictability of dependence in the context of asset‐allocation strategies, and find that risk‐averse investors obtain significant economic values by incorporating asymmetry and dynamics into dependence timing, particularly in the 2007–2008 crisis. These findings provide new implications for asset‐allocation strategies and risk management during turbulent market phases. [ABSTRACT FROM AUTHOR]

Published
2021
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