161 results on '"Wilde, Jürgen"'
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2. Research on the creep response of lead-free die attachments in power electronics
3. A study on the thermomechanical response of various die attach metallic materials of power electronics
4. Anand constitutive modeling of multilayer Silver-Tin transient liquid phase foils using tensile and creep testing
5. The variation in Anand model parameters – How does that affect the bond's response? A comparative study considering sintered Ag bonds
6. Bayesian calibration of ball grid array lifetime models for solder fatigue
7. Experiments, constitutive modeling, and simulations on the creep behavior of the AgSn transient liquid phase metallic bonds
8. In situ analysis of electrochemical deposition kinetics for nanocrystalline nickel-cobalt alloys with varying bath hydrodynamics
9. Effect of Electrochemical Potential on Tribocorrosion Behaviour of AISI 420
10. A novel online 4-point rainflow counting algorithm for power electronics
11. The influence of strain hardening of copper on the crack path in Cu/Al2O3/Cu direct bonded copper substrates
12. Ablation characteristics of picosecond laser single point drilling of Si3N4 under dry and water medium
13. Application of machine learning to predict the product quality and geometry in circular laser grooving process
14. Numerical Evaluation of Sintered Silver Die Attachments Based on Different Material Parameters and Creep Constitutive Models
15. Applying Anand versus Garofalo creep constitutive models for simulating sintered silver die attachments in power electronics
16. Applying Anand versus Garofalo creep constitutive models for simulating sintered silver die attachments in power electronics.
17. Assessment methods for the characterization of flux material systems toward water absorption
18. Reliability modeling of Sn–Ag transient liquid phase die-bonds for high-power SiC devices
19. Zuverlässigkeit von Sensoren
20. Effect of microstructural evolution during dry sliding on the corrosion behaviour of martensitic stainless steel
21. Electromechanical properties of housed piezoelectric CTGS resonators at high temperatures – Modeling of housing influence
22. The Nature of Screen Printed Front Side Silver Contacts - Results of the Project MikroSol
23. Study of Contact Formation of Printed Contacts through Different Passivation Layers on Lowly Doped Emitters
24. Evaluation of Industrially Relevant Parameters for Contact Firing of Screen Printed Front Side Silver Contacts
25. Über die Bestimmung der Bruchzähigkeit von monokristallinen Schichten und deren Haftfestigkeit als Dünnschicht auf Siliziumsubstrat mittels instrumentierter Eindringprüfung
26. Evaluation of chip breaking in combined laser-turning process
27. Assembly and interconnection technology for high-temperature bulk acoustic wave resonators
28. Microstructural changes of lead‐free solder joints during long‐term ageing, thermal cycling and vibration fatigue
29. High-temperature behavior of housed piezoelectric resonators based on CTGS
30. Zuverlässigkeit von Sensoren
31. Influence of Bath Hydrodynamics on the Micromechanical Properties of Electrodeposited Nickel-Cobalt Alloys
32. High-speed electronic speckle pattern interferometry for analysis of thermo-mechanical behavior of electronic components
33. Integration of Liquid Cooling, Thermal and Thermomechanical Design for the Lifetime Prediction of Electrical Power Modules
34. In Situ Electroanalytical Modelling of the Influence of Bath Hydrodynamics on Nucleation Kinetics for Electrodeposition of Nickel-Cobalt alloy system
35. Investigation and improvement of DMOS switches under fast electro-thermal cycle stress
36. Self-assembly of dies through electrostatic attraction: modelling of alignment forces and kinematics
37. Comparison of analysis methods for package-induced stresses on moulded Hall sensors
38. The influence of package-induced stresses on moulded Hall sensors
39. Electronic module assembly
40. Parameter Study on UV-induced Degradation of Dye-sensitized Solar Cells
41. Testing, Calibration and Compensation
42. Self-assembly of microsystem components with micrometer gluing pads through capillary forces
43. Lifetime Model for the Fatigue Fracture in Cu/Al2O3/Cu Composites: Experimental Validation of a Substantial Lifetime Enhancement by Cu Step Etching
44. Design optimization of an eddy current sensor using the finite-elements method
45. Durability studies on vibration-loaded electrical contact systems subjected to tribological stress
46. Analysis of the metallic structure of microspheres produced by printing of aluminum alloys from the liquid melt
47. Surrogate Modeling for Creep Strain-Based Fatigue Prediction of a Ball Grid Array Component
48. Rapid lactic acid production at high cell concentrations in whey ultrafiltrate by Lactobacillus helveticus
49. Zuverlässigkeitsstudien an silbergesinterten leistungselektronischen Modulen ohne Nutzung von DCB-Substraten.
50. Performance and failure analysis of concentrator solar cells after intensive stressing with thermal, electrical, and combined load
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