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Purpose: To make an attempt to explain the model of Higher-Level Dual Education at John Von Neumann University. Design/methodology/approach: The present study offers a descriptive research design by highlighting a Dual Studies program John Von Neumann University Model Findings: In this model studies, our most important long-term goal is to become an attractive intellectual center, to provide marketable qualifications, above all for those living in the region, and to equip our students with knowledge and skills that help them in career-planning and entering in the labor market Research Limitations/Implications: The current study is not based on empirical testing Originality/Value: This research is supported by EFOP-3.6.1-16-2016-00006. The development and enhancement of the research potential at John von Neumann University" project. The Project is supported by the Hungarian Government and co-financed by the European Social Fund.

This study is about the structural transformations of aluminium examining with the Dynamic Mechanical Thermal Analyzer (DMTA). It is a faster and simpler measuring method to make consequence about the metal's structural transformations. The device measures the changing of the mechanical characteristics depending on the heating rate, and concludes certain transformations. This measuring method fast and shows clean-cut results comparing the conventional ways. Applying polymer measuring devices for metal investigations is not widespread method. One of the adaptable ways is shown in this study. The article compares the results of the small specimen test and the DMTA method, considering the temperature and the forming dependence of recrystallization temperature., {"references":["Damelis Pino, Luis Acuna, Ney José Luiggi: Study Of the Mg2Si Phase\nin a 6063 Al Commercial Alloy Using Dilatometric Techniques,\nMaterials Science Frum Vols. 217-222 (1996) pp 833 – 838.","G.D. Fan, M.Y. Zheng, X.S. Hu, C. Xu, K. Wu, I.S. Golovin: Effect of\nheat treatment on internal friction in ECAP processed commercial pure\nMg, Journal of Alloys and Compounds 549 (2013) 38–45, 2013","G. Thomas, j. inst. of Metals 90, 57 , 1961","A. Lutts, Act Metall 9, 577 , 1961","R. C. Dorward, Metall Trans 4, 507 , 1982","J. P. Linch. L. M. Brown and M. H. Jacobs Act. Metall 30, 1389, 1982","N. J. Luggi and A. E. Betancourt, Metall and Mat. Trans. B 25 B, 917,\n1994","L. F. Mondolofo, Aluminium Alloys, Structure and Properties, Butter\nWorths, London 1976","Kirchfeld Mária: Műszaki anyagok, SZE, Győr, 2007.\n[10] Z.C. Zhou, J.Y. Xiong, S.Y. Gu, D.K. Yang, Y.J. Yan , J. Du: Anelastic\nrelaxation caused by interstitial atoms in b-type sintered Ti–Nb alloys,\nJournal of Alloys and Compounds 509 (2011) 7356–7360, 2011\n[11] J.L. Murray, Phase Diagram of Binary Titanium Alloys, Materials Park,\nASM, Ohio 1987.\n[12] G.D. Fan, M.Y. Zheng, X.S. Hu, C. Xu, K. Wu, I.S. Golovin: Effect of\nheat treatment on internal friction in ECAP processed commercial pure\nMg, Journal of Alloys and Compounds 549 (2013) 38–45, 2013\n[13] Shih-Hang Chang: Internal friction of Cu–13.5Al–4Ni shape memory\nalloy measured by dynamic mechanical analysis under isothermal\nconditions, Materials Letters 64 (2010) 93–95, 2010\n[14] Adelaide Nespoli, Francesca Passaretti, Elena Villa: Phase transition and\nmechanical damping properties: A DMTA study of NiTiCu shape\nmemory alloys, Intermetallics, Volume 32 (2013) 394-400, 2013\n[15] R.E. Wetton, J.S. Fisher, K.E. Pettitt, A. Evans, J.C. Duncan, American\nLaboratory, (1993)\n[16] Menard, Kevin P.: Dynamic Mechanical Analysis: A Practical\nIntroduction. CRC Press (1999)\n[17] J. Màs et al.: \"Dynamic mechanical properties of polycarbonate and\nacrylonitrile-butadiene-styrene copolymer blends\". Journal of Applied\nPolymer Science 83 (7) (2002) 1507–1516"]}

The temperature dependence of wettability (wetting angle, Θ (T)) for Ag-based melts on graphite and Al2O3 substrates is compared. Typical alloying effects are found, as the Ag host metal is gradually replaced by various metallic elements. The essence of alloying lies in the change of the electron/atom (e/a) ratio. This ratio is also manifested in the shift of wetting angles on the same substrate. Nevertheless, the effects are partially smeared by other (metallurgical) factors, like the interaction between the oxygenalloying elements and by the graphite substrate-oxygen interaction. In contrast, such effects are not pronounced in the case of Al2O3 substrates. As a consequence, Θ(T) exhibits an opposite trend in the case of two substrates. Crossovers of the Θ(T) curves were often found. The positions of crossovers depend on the chemical character and concentration of solute atoms. Segregation and epitaxial texture formation after solidification were also observed in certain alloy drops, especially in high concentration range. This phenomenon is not yet explained in every detail., {"references":["M. Judd, K. Brindley, Soldering in Electronics Assembly. 2nd ed., Newnes, Oxford, UK, 1999.","K. N. Tu, Solder Joint Technology: Materials, Properties, and Reliability. Springer, NY, USA, 2007.","C. C. Fu, C. C. Chen,\"Investigations of wetting properties of Ni–V and Ni–Co alloys by Sn, Sn–Pb, Sn–Cu, and Sn–Ag–Cu solders\", Journal of the Taiwan Institute of Chemical Engineers, 42., 2011.","M. Erinc, P. J. G. Schreurs, G. Q. Zhang, M. G. D. Geers. \"Microstructural damage analysis of SnAgCu solder joints and an assessment on indentation procedures,\" Journal of Materials Science: Materials in Electronics, Volume 16. 2003.","K. L. Lin, C. L. Shih,\"Wetting interaction between Sn-Zn-Ag solders and Cu,\" Journal of Electronic Materials, Volume 32. 2003.","F. Dömötör, \"Complex diagnostics of the cutting process of metal composite structures,\" 9th Danubia-Adria Symposium on Advances in Experimental Mechanics Beograd, 2012","L. J. Matienzo, R. R. Schaffer,\"Wetting behaviour of eutectic tin/lead solder and fluxes on copper surfaces,\" Journal of Materials Science Volume 26/3. 1991.","B. Vehovszky, P. Kamasa, J. Kovác, ZS. Fogarassy. \"Complex Study of H-induced Structural Rearrangements in FeZr Glasses,\"Materials Science Forum, Vol. 729. 2013.","L. R. Garcia, W. R. Osório, L. C. Peixoto, Am Garcia. \"Wetting Behavior and Mechanical Properties of Sn-Zn and Sn-Pb Solder Alloys,\" Journal of Electronic Materials, Volume 38/11. 2009.\n[10]\tG. Kaptay. \"Classification and general derivation of interfacial forces, acting on phases, situated in the bulk, or at the interface of other phases,\" J.Mater.Sci.40. 2005.\n[11]\tP.Baumli, G.Kaptay. \"Wettability of carbon surfaces by pure molten alkali chlorides and their penetration into a porous graphite substrate,\" Mater SciEng A. 495. 2008.\n[12]\tM. Abtew, G. Seldavuray,Mater. Sci. Eng. 27. 2007.\n[13]\tW.H. Zhong, Y.C. Chan, M.O. Alam, B.Y. Wu, J.F. Guan. \"Effect of multiple reflow processes on the reliability of ball grid array (BGA) solder joints,\" Journal of Alloys and Compounds. 414. 2006.\n[14]\tJ. Hlinka, Z. Weltsch, \"Relation between the Wetting Property and Electrical Conduction of Silver-Gold (Ag-Au) Alloys\" Periodica Polytechnica Transportation Engineering, 41/2. 2013.\n[15]\tP. Casey, M. Pecht, Proceedings of the Fourth International Symposium of EMP, Taiwan, 2002.\n[16]\tB. C. Allen,\"Surface Tension in Liquid Metals,\"Liquid Metals (Chemistry and Physics), INC., New York. 1972.\n[17]\tAlloy Phase Diagrams Centre. ASM International, Materials Park, OH. 2006.\n[18]\tW. Hume-Rothery,Phase Stability in Metals and Alloys. McGraw-Hill Publ. Co., New York, 1967.\n[19]\tH. O'Neill,Hardness measurements of metals and alloys. Chapman and Hall Ltd. 1967.\n[20]\tS. Flügge, Encyclopedia of Physics, Volume XIX. Electrical Conductivity, Springer-Verlag, 1956.\n[21]\tF. D. Richardson, Physical Chemistry of Melts in Metallurgy. Academic Press London, New York Volume 2. 1974.\n[22]\tDoITPoMS, University of Cambridge, http://www.doitpoms.ac.uk/tlplib/ellingham_diagrams"]}