1. Experimental Characterizing Mechanical and Physical Properties of Water Lily Polyester Matrix Composite Materials.
- Author
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Kebede, Melese Shiferaw, Ayaliew, Tesfa Guadie, Demlie, Solomon Mesfin, and Ahmad, Sheraz
- Subjects
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MECHANICAL behavior of materials , *WATER lilies , *FIBROUS composites , *AUTOMOBILE interiors , *WATER hyacinth , *SISAL (Fiber) , *NATURAL fibers - Abstract
The use of natural fibers (NFs) in polymer composites is a modern trend aimed at developing materials with numerous benefits, including low cost, environmental friendliness, biodegradability, and high specific mechanical performance. Ethiopia is abundant in NFs such as palm trees, sisal, water hyacinth, and the newly emerging water lilies. In areas like Lake Tana, Ethiopia, water lilies, much like water hyacinths, negatively impact water surfaces by covering them and reducing their surface area. Therefore, analyzing the mechanical and physical properties of composites reinforced with these fibers is crucial for diverse structural and industrial applications, considering factors such as tensile strength, flexural strength, and hardness. In this study, a composite material consisting of a water lily–polyester resin matrix was prepared with varying matrix‐to‐fiber weight ratios (90/10 wt%, 80/20 wt%, 70/30 wt%, 60/40 wt%, 50/50 wt%, and 40/60 wt%). The experimental data revealed that the optimal mechanical properties, including maximum tensile strength, flexural strength, and hardness, were achieved with a composition of 60% matrix material and 40% reinforcing material. These chopped water lily fiber–reinforced polyester composites demonstrate promising mechanical and physical properties, making them suitable for various applications, similar to other NFs like sisal and palm. Further studies, such as thermal analysis, could enhance the understanding and utilization of these composites. The fabricated water lily composite can serve as a viable alternative material for applications in automobile interior parts, building components, and electronic packages. [ABSTRACT FROM AUTHOR]
- Published
- 2024
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