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In recent years, some manufacturers outsource the warranty service for flexibility and cost efficiency. Therefore, the manufacturer has to face a problem of outsourcing warranty contract design to deal with the fraud of the agents in service. Considering a price‐and‐service‐sensitive demand, we studied two warranty‐outsourcing contracts (the fixed‐price contract and the cost‐based contract) in a supply chain setting comprising one risk‐neutral manufacturer and one risk‐averse service agent. The results show that, when the market is sensitive to warranty service, the cost‐based contract benefits the manufacturer in demand promotion. Interestingly, even if the cost‐based contract increases the amount of consumers for the service agent, the fixed‐price contract always benefits the agent with low risk‐aversion level. [ABSTRACT FROM AUTHOR]

Micron level Cu-pillar microbumps, which appear as the size of three-dimensional packaging shrinks down, have to introduce many unexpected reliability problems. The fast growth of intermetallic compounds (IMC) and voids tend to be a serious one. In this paper, the growth behaviors of IMC and voids were investigated in Sn-3.5Ag/Ni/Cu bumps, which were in the diameter ranging from 6 to 11 μm and fabricated under same reflow process. The consequence manifested that the growth rate of interfacial IMC increased from 0.448 to 0.578 μm/min as the bump diameter decreased from 11 to 6 μm and the acquired IMC could be divided into two layers: the (Cu, Ni)Sn layer and NiSn layer. As a result of the migration of Ni atoms, many voids were left in the interface between (Cu, Ni)Sn and NiSn. In the edge of Cu pillar, side wall wetting reaction was detected, which was confirmed by the formation of voids and (Cu, Ni)Sn phase. Further, as the bump diameter decreased, the side wall wetting reaction aggravated, which partly contributed to the acceleration of IMC growth. [ABSTRACT FROM AUTHOR]