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3. Trusted Data Acquisition in Microelectronics Manufacturing as a Basis for ML-Optimized Processing

Author

Becker, K. F., primary, Voges, S., additional, Fruehauf, P., additional, Heimann, M., additional, Nerreter, S., additional, Blank, R., additional, Erdmann, M., additional, Gottwald, S., additional, Hofmeister, A., additional, Lopuszanski, P., additional, Hesse, M., additional, Thies, M., additional, Mehrafsun, S., additional, Fust, R., additional, Beck, E., additional, Becicka, M., additional, Pawlikowski, J., additional, Schroeder, B., additional, Voigt, C., additional, Braun, T., additional, and Schneider-Ramelow, M., additional

Published
2024
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8. Implementation of Trusted Manufacturing & AI-based process optimization into microelectronic manufacturing research environments

Author

Becker, K.-F., primary, Voges, S., additional, Fruehauf, P., additional, Heimann, M., additional, Nerreter, S., additional, Blank, R., additional, Erdmann, M., additional, Gottwald, S., additional, Hofmeister, A., additional, Hesse, M., additional, Thies, M., additional, Mehrafsun, S., additional, Fust, R., additional, Beck, E., additional, Pawlikowski, J., additional, Schröder, B., additional, Voight, C., additional, Braun, T., additional, and Schneider-Ramelow, M., additional

Published
2021
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10. Panel Level Packaging - From Idea to Industrialization -

Author

Braun, T., primary, Becker, K.-F., additional, Hoelck, O., additional, Voges, S., additional, Boettcher, L., additional, Topper, M., additional, Stobbe, L., additional, Aschenbrenner, R., additional, Voitel, M., additional, Schneider-Ramelow, M., additional, and Lang, K.-D., additional

Published
2019
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12. Highly Miniaturized Integrated Sensor Nodes for Industry 4.0

Author

Voges, S., primary, Becker, K.-F., additional, Schütze, D., additional, Schröder, B., additional, Fruehauf, P., additional, Heimann, M., additional, Nerreter, S., additional, Blank, R., additional, Gottwald, S., additional, Hofmeister, A., additional, Schmied, M., additional, Kreitmair, M., additional, Fust, R., additional, Neifer, W., additional, Braun, T., additional, Thomas, T., additional, Schneider-Ramelow, M., additional, and Lang, K.-D., additional

Published
2019
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13. Where is the Sweet Spot for Panel Level Packaging?

Author

Braun, T, primary, Becker, K. -F., additional, Hoelck, O., additional, Voges, S., additional, Woehrmann, M., additional, Boettcher, L., additional, Toepper, M., additional, Stobbe, L., additional, Aschenbrenner, R., additional, Schneider-Ramelow, M., additional, and Lang, K. -D., additional

Published
2019
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15. Panel Level Packaging - A View Along the Process Chain

Author

Braun, Tanja, primary, Becker, K.-F., additional, Hoelck, O., additional, Kahle, R., additional, Wohrmann, M., additional, Boettcher, L., additional, Topper, M., additional, Stobbe, L., additional, Zedel, H., additional, Aschenbrenner, R., additional, Voges, S., additional, Schneider-Ramelow, M., additional, and Lang, K.-D., additional

Published
2018
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16. Fan-out wafer level packaging for 5G and mm-Wave applications

Author

Braun, T., primary, Becker, K.-F., additional, Hoelck, O., additional, Kahle, R., additional, Woehrmann, M., additional, Toepper, M., additional, Ndip, I., additional, Maass, U., additional, Tschoban, C., additional, Aschenbrenner, R., additional, Voges, S., additional, and Lang, K.-D., additional

Published
2018
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17. 0.13-μm SiGe BiCMOS technology with More-than-Moore modules

Author

Kaynak, M., primary, Wietstruck, M., additional, Goritz, A., additional, Wipf, S. Tolunay, additional, Inac, M., additional, Cetindogan, B., additional, Wipf, C., additional, Kaynak, C. Baristiran, additional, Wohrmann, M., additional, Voges, S., additional, and Braun, T., additional

Published
2017
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18. Development of a Multi-project Fan-Out Wafer Level Packaging Platform

Author

Braun, T., primary, Raatz, S., additional, Maass, U., additional, Van Dijk, M., additional, Walter, H., additional, Holck, O., additional, Becker, K.-F., additional, Topper, M., additional, Aschenbrenner, R., additional, Wohrmann, M., additional, Voges, S., additional, Huhn, M., additional, Lang, K.-D., additional, Wietstruck, M., additional, Scholz, R. F., additional, Mai, A., additional, and Kaynak, M., additional

Published
2017
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19. Heterogeneous integration of a miniaturized W-band radar module

Author

Becker, Karl-Friedrich, Georgi, L., Kahle, R., Koch, M., Voges, S., Brandenburger, F., Höfer, J., Ehrhardt, C., Zech, C., Baumann, B., Huelsmann, A., Grasenack, A., Reinold, S., Kleiner, B., Braun, T., Schneider-Ramelow, M., Lang, K.-D., and Publica

Abstract

For radar applications, the W-band frequency range (75 - 110 GHz) is a good candidate for high-resolution distance measurement and remote detection of small or hidden objects in distances of 10 cm to >> 20 m. As electromagnetic waves in this frequency range can easily penetrate rough atmosphere like fog, smoke or dust, W-band radars are perfectly suited for automotive, aviation, industrial and security applications. Additional benefit is that atmosphere has an absorption minimum at 94 GHz, so relative small output power is sufficient to achieve long range coverage. By combining and enhancing knowledge from the disciplines of heterogeneous integration technology and compound semiconductor-technology, the Fraunhofer Institutes IAF, IPA and IZM developed a miniaturized and low cost 94 GHz radar module. Result of this approach is a highly miniaturized radar module built using a modular approach. The radar components are mounted on a dedicated RF-NF-hybrid PCB while the signal processing is done on a separate board stacked below. This hybrid RF-module is combined with highly integrated digital processing PCB via micro connectors in a way that the radar system and an adapted conical HDPE-lens fit into an aluminum housing of 42x80x27 mm³ with a weight of only 160 grams for the whole module. The paper will describe the technological basis for such a frequency modulated continuous wave [FMCW] W-band radar module and describe in detail the technological features that enabled the assembly of such a miniaturized but high-performance system. The module yields an evaluated distance measurement accuracy of 5 ppm (5 mm deviation per meter target distance) while its low weight and small dimensions pave the way for a variety of new applications, including mobile operation.

Published
2015

20. Lebenserwartung und Lebergröße bei Metastasenleber: Untersuchungen zur prognostischen Bedeutung des Palpationsbefundes

Author

Voges S, Assel H, and Fedderke J

Subjects
medicine.medical_specialty, business.industry, Internal medicine, Retrospective analysis, Life expectancy, Medicine, General Medicine, business, Gastroenterology, Value (mathematics)
Abstract

A retrospective analysis of survival time of 348 patients with liver metastases indicates that both the extent of liver enlargement and also its increased firmness and changes at its surface are easily obtainable findings of prognostic value. In the presence of liver metastases there is a significant correlation between median life expectancy and size of the liver.

Published
2008
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21. Implementation of Trusted Manufacturing & AI-based Process Optimization into Microelectronic Manufacturing Research Environments.

Author

Becker, K.-F., Voges, S., Fruehauf, P., Heimann, M., Nerreter, S., Blank, R., Erdmann, M., Gottwald, S., Hofmeister, A., Hesse, M., Thies, M., Mehrafsun, S., Fust, R., Beck, E., Pawlikowski, J., Schröder, B., Voight, C., Braun, T., and Schneider-Ramelow, M.

Subjects
MANUFACTURING processes, PROCESS optimization, TRUST, ENTERPRISE resource planning, MANUFACTURING execution systems
Abstract

Digitization is one of the hot topics in all Industry 4.0 efforts that are currently discussed. Often the focus is on digitization of business processes with a financial/organizational perspective on manufacturing, so the tools are adapting to enterprise resource planning [ERP] and manufacturing execution system [MES] rather than on actual manufacturing issues on the shop floor. Within the SiEvEI 4.0 project, a research consortium from the area of electronics manufacturing is working on digitization for a manufacturing scenario where high value electronic goods are built in a distributed manufacturing environment. Key research topics addressed are the implementation of a Chain of Trust [CoT] for such a distributed manufacturing, i.e. and the application of artificial intelligence/machine learning to analyze and eventually optimize manufacturing processes. The paper will introduce the concept of both COT and AI-based process analysis that will later on be transferred into a microelectronics production environment. Two reference processes are targeted: SMD assembly using fully automated manufacturing equipment; and Solder Ball Application using a high-mix/low volume concept. As a result, the paper presents a concept of how to digitize manufacturing processes and use this digital description of a process combination to make a distributed manufacturing flow safe and increase product/process quality. [ABSTRACT FROM AUTHOR]

Published
2022

22. On the Way from Fan-out Wafer to Fan-out Panel Level Packaging

Author

Becker, Karl-Friedrich, primary, Braun, Tanja, additional, Raatz, S., additional, Minkus, M., additional, Bader, V., additional, Bauer, J., additional, Aschenbrenner, R., additional, Kahle, R., additional, Georgi, L., additional, Voges, S., additional, Wöhrmann, M., additional, and Lang, K.-D., additional

Published
2016
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23. High viscosity paste dosing for microelectronic applications

Author

Thomas, T., primary, Voges, S., additional, Braun, T., additional, Raatz, S., additional, Kahle, R., additional, Becker, K.-F., additional, Koch, M., additional, Fliess, M., additional, Bauer, J., additional, Schneider-Ramelow, M., additional, and Lang, K.-D., additional

Published
2016
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24. Foldable Fan-Out Wafer Level Packaging

Author

Braun, T., primary, Becker, K. -F., additional, Raatz, S., additional, Minkus, M., additional, Bader, V., additional, Bauer, J., additional, Aschenbrenner, R., additional, Kahle, R., additional, Georgi, L., additional, Voges, S., additional, Wohrmann, M., additional, and Lang, K.-D., additional

Published
2016
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25. Material and process trends for moving from FOWLP to FOPLP

Author

Braun, T., primary, Voges, S., additional, Topper, M., additional, Wilke, M., additional, Wohrmann, M., additional, Maas, U., additional, Huhn, M., additional, Becker, K.-F., additional, Raatz, S., additional, Kim, J.-U., additional, Aschenbrenner, R., additional, Lang, K.-D., additional, O'Connor, C., additional, Barr, R., additional, Calvert, J., additional, Gallagher, M., additional, Iagodkine, E., additional, Aoude, T., additional, and Politis, A., additional

Published
2015
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26. Heterogeneous integration of a miniaturized W-band radar module

Author

Becker, K.-F., primary, Georgi, L., additional, Kahle, R., additional, Voges, S., additional, Brandenburger, F., additional, Höfer, J., additional, Ehrhardt, C., additional, Zech, C., additional, Baumann, B., additional, Huelsmann, A., additional, Grasenack, A., additional, Reinold, S., additional, Kleiner, B., additional, Braun, T., additional, Schneider-Ramelow, M., additional, and Lang, K.-D., additional

Published
2015
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27. From fan-out wafer to fan-out panel level packaging

Author

Braun, T., primary, Becker, K.-F., additional, Raatz, S., additional, Bader, V., additional, Bauer, J., additional, Aschenbrenner, R., additional, Voges, S., additional, Thomas, T., additional, Kahle, R., additional, and Lang, K.-D., additional

Published
2015
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31. 24"×18" Fan-out panel level packing

Author

Braun, T., primary, Becker, K.-F., additional, Voges, S., additional, Bauer, J., additional, Kahle, R., additional, Bader, V., additional, Thomas, T., additional, Aschenbrenner, R., additional, and Lang, K.-D., additional

Published
2014
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32. Panel level packaging for LED lighting

Author

Braun, T., primary, Bauer, J., additional, Becker, K.-F., additional, Kahle, R., additional, Bader, V., additional, Voges, S., additional, Jordan, R., additional, Aschenbrenner, R., additional, and Lang, K.D., additional

Published
2013
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35. Through mold via technology for multi-sensor stacking

Author

Braun, T., primary, Brundel, M., additional, Becker, K.-F., additional, Kahle, R., additional, Piefke, K., additional, Scholz, U., additional, Haag, F., additional, Bader, V., additional, Voges, S., additional, Thomas, T., additional, Aschenbrenner, R., additional, and Lang, K.-D., additional

Published
2012
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36. Large area mold embedding technology with PCB based redistribution

Author

Braun, T., primary, Becker, K.-F., additional, Bottcher, L., additional, Ostmann, A., additional, Jung, E., additional, Voges, S., additional, Thomas, T., additional, Kahle, R., additional, Bader, V., additional, Bauer, J., additional, Aschenbrenner, R., additional, Schneider Ramelow, M., additional, and Lang, K.-D., additional

Published
2012
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37. Through mold vias for stacking of mold embedded packages

Author

Braun, T., primary, Becker, K.-F., additional, Voges, S., additional, Thomas, T., additional, Kahle, R., additional, Bader, V., additional, Bauer, J., additional, Piefke, K., additional, Kruger, R., additional, Aschenbrenner, R., additional, and Lang, K.-D., additional

Published
2011
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44. 3D stacking approaches for mold embedded packages.

Author

Braun, T., Becker, K.-F., Piefke, K., Voges, S., Thomas, T., Topper, M., Fischer, T., Kahle, R., Bader, V., Bauer, J., Aschenbrenner, R., and Lang, K.-D.

Abstract

The constant drive to further miniaturization and heterogeneous system integration leads to a need for new packaging technologies which also allow large area processing and 3D integration with potential for low cost applications. Large area mold embedding technologies and embedding of active components into printed circuit boards (Chip-in-Polymer) are two major packaging trends in this area. [ABSTRACT FROM PUBLISHER]

Published
2011

48. Gasunterstützte Ölsaat-PressungVortrag anlässlich der DECHEMA-Jahrestagung 2006, 26./28. September 2006 in Wiesbaden.

Author

Voges, S., Eggers, R., and Pietsch, A.

Abstract

Die in den letzten Jahren wachsende Bedeutung von Ölsaaten wie Raps und Soja unter anderem als alternative Kraftstoffquellen macht eine Effizienzsteigerung der Fest/Flüssig-Trennung zunehmend interessant. Herkömmlich wird die Speiseölgewinnung durch eine kontinuierliche Lösungungsmittelextraktion mit Hexan vorgenommen, der eine mechanische Fest/Flüssig-Trennung auf einer Schneckenpresse vorgeschaltet sein kann. Bei dem neuen Verfahren der gasunterstützten Pressung handelt es sich um eine mechanische Fest/Flüssig-Trennung unter Zuhilfenahme eines verdichteten Gases. Dieses Gas ist bevorzugt CO2 und wird vor oder während der Pressung mit der Ölsaat in Kontakt gebracht, um so einen verbesserten Abpressgrad zu erreichen. Die Effizienz dieses Verfahrens konnte in eigenen Experimenten nachgewiesen werden. Die Vorteile sind die Ausbeuteerhöhung sowie der denkbare völlige Verzicht auf konventionelle brennbare Lösungsmittel bei der Gewinnung vegetabiler Öle.

Published
2007
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49. Growth of Namibian silver kob Agyrosomus inodorusbased on otoliths and mark-recapture data

Author

Kirchner, C. H. and Voges, S. F.

Abstract

The growth of silver kob Argyrosomus inodorussampled from two regions (northern and southern) along the Namibian coast was determined using longitudinally sectioned otoliths. The special Von Bertalanffy growth model adequately described the growth of kob in both regions. Growth rate for kob in the south was validated using mark-recapture data, and similar growth rates were obtained using both methods. Growth of kob sampled in the south (maximum age 19 years) was significantly different from those in the north (maximum age 28 years). Kob from the two regions appeared to be from the same stock, and consequently length-at-age data from the regions can be pooled for management purposes. Growth of Namibian silver kob was markedly different from the South African silver kob, for which growth was best described by logistic (South-Western Cape) and Richards (Southern and South-Eastern Cape) models. The special Von Bertalanffy growth parameters were determined by the equations:Lt= 116 (1−e0.120(t + 1.47)) mm for the southern region,Lt= 112 (1−e−0.094(t + 2.29)) mm for the northern regions,Lt= 103 (1−e−0.136(t + 1.58)) mm for both regions combined.

Published
1999
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