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Any metrology tool is only as good as it is calibrated. The characterization of metrology systems requires test patterns at a scale about ten times smaller than the measured features. The fabrication of patterns with linewidths down to 1.5 nm is described. The test sample was designed in such a way that the distribution of linewidths appears to be random at any location. This pseudorandom test pattern is used to characterize dimensional metrology equipment over its entire dynamic range by extracting the modulation transfer function of the system. The test pattern contains alternating lines of silicon and tungsten silicide, each according to its designed width. The fabricated test samples were imaged using a transmission electron microscope, a scanning electron microscope, and an atomic force microscope.

Data for interpreting virus inactivation on N95 face filtering respirators (FFRs) by ultraviolet (UV) radiation are important in developing UV strategies for N95 FFR disinfection and reuse for any situation, whether it be everyday practices, contingency planning for expected shortages, or crisis planning for known shortages. Data regarding the integrity, form, fit, and function of N95 FFR materials following UV radiation exposure are equally important. This article provides these data for N95 FFRs following UV-C irradiation (200 nm to 280 nm) in a commercial UV-C enclosure. Viral inactivation was determined by examining the inactivation of OC43, a betacoronavirus, inoculated on N95 FFRs. Different metrological approaches were used to examine irradiated N95 FFRs to determine if there were any discernible physical differences between non-irradiated N95 FFRs and those irradiated using the UV-C enclosure. Material integrity was examined using high-resolution scanning electron microscopy. Form, fit, and function were examined using flow resistance, tensile strength, and particle filtration measurements. A separate examination of filter efficiency, fit, and strap tensile stress measurements was performed by the National Personal Protective Technology Laboratory. Data from these metrological examinations provide evidence that N95 FFR disinfection and reuse using the UV-C enclosure can be effective.

Electrical double layers play a key role in a variety of electrochemical systems. The mean free path of secondary electrons in aqueous solutions is on the order of a nanometer, making them suitable for probing ultrathin electrical double layers at solid-liquid electrolyte interfaces. Employing graphene as an electron-transparent electrode in a two-electrode electrochemical system, we show that the secondary electron yield of the graphene-liquid interface depends on the ionic strength and concentration of the electrolyte and the applied bias at the remote counter electrode. These observations have been related to polarization-induced changes in the potential distribution within the electrical double layer and demonstrate the feasibility of using scanning electron microscopy to examine and map electrified liquid-solid interfaces.

Low-cost, high-throughput and nondestructive metrology of truly three-dimensional (3-D) targets for process control/monitoring is a critically needed enabling technology for high-volume manufacturing (HVM) of nano/micro technologies in multi-disciplinary areas. In particular, a survey of the typically used metrology tools indicates the lack of a tool that truly satisfies the HVM metrology needs of 3-D targets, such as high aspect ratio (HAR) targets. Using HAR targets here we demonstrate that through-focus scanning optical microscopy (TSOM) is a strong contender to fill the gap for 3-D shape metrology. Differential TSOM (D-TSOM) images are extremely sensitive to small and/or dissimilar types of 3-D shape variations. Based on this here we propose a TSOM method that involves creating a database of cross-sectional profiles of the HAR targets along with their respective D-TSOM signals. Using the database, we present a simple-to-use, low-cost, high-throughput and nondestructive process-monitoring method suitable for HVM of truly 3-D targets, which also does not require optical simulations, making its use straightforward and automatable. Even though HAR targets are used for this demonstration, the similar process can be applied to any truly 3-D targets with dimensions ranging from micro-scale to nano-scale. The TSOM method couples the advantage of analyzing truly isolated targets with the ability to simultaneously analyze many targets present in the large field-of-view of a conventional optical microscope.

The semiconductor industry continues to produce ever smaller devices that are ever more complex in shape and contain ever more types of materials. The ultimate sizes and functionality of these new devices will be affected by fundamental and engineering limits such as heat dissipation, carrier mobility and fault tolerance thresholds. At present, it is unclear which are the best measurement methods needed to evaluate the nanometre-scale features of such devices and how the fundamental limits will affect the required metrology. Here, we review state-of-the-art dimensional metrology methods for integrated circuits, considering the advantages, limitations and potential improvements of the various approaches. We describe how integrated circuit device design and industry requirements will affect lithography options and consequently metrology requirements. We also discuss potentially powerful emerging technologies and highlight measurement problems that at present have no obvious solution.

X-ray masks present a measurement object that is different from most other objects used in semiconductor processing because the support membrane is, by design, x-ray transparent. This characteristic can be used as an advantage in electron beam-based x-ray mask metrology since, depending upon the incident electron beam energies, substrate composition and substrate thickness, the membrane can also be essentially electron transparent. The areas of the mask where the absorber structures are located are essentially x-ray opaque, as well as electron opaque. This paper shows that excellent contrast and signal-to-noise levels can be obtained using the transmitted-electron signal for mask metrology rather than the more commonly collected secondary electron signal. Monte Carlo modeling of the transmitted electron signal was used to support this work in order to determine the optimum detector position and characteristics, as well as in determining the location of the edge in the image profile. The comparison between the data from the theoretically-modeled electron beam interaction and actual experimental data were shown to agree extremely well, particularly with regard to the wall slope characteristics of the structure. Therefore, the theory can be used to identify the location of the edge of the absorber line for linewidth measurement. This work provides one approach to improved x-ray mask linewidth metrology and a more precise edge location algorithm for measurement of feature sizes on x-ray masks in commercial instrumentation. This work also represents an initial step toward the first SEM-based accurate linewidth measurement standard from NIST, as well as providing a viable metrology for linewidth measurement instruments of x-ray masks for the lithography community.

NIST is in the process of developing a new scanning electron microscope (SEM) magnification calibration reference standard useful at both high and low accelerating voltages. This standard will be useful for all applications to which the SEM is currently being used, but it has been specifically tailored to meet many of the particular needs of the semiconductor industry. A small number of test samples with the pattern were prepared on silicon substrates using electron beam lithography at the National Nanofabrication Facility at Cornell University. The structures were patterned in titanium/palladium with maximum nominal pitch structures of approximately 3000 μm scaling down to structures with minimum nominal pitch of 0.4 (μm. Eighteen of these samples were sent out to a total of 35 university, research, semiconductor and other industrial laboratories in an interlaboratory study. The purpose of the study was to test the SEM instrumentation and to review the suitability of the sample design. The laboratories were asked to take a series of micrographs at various magnifications and accelerating voltages designed to test several of the aspects of instrument performance related to general SEM operation and metrology. If the instrument in the laboratory was used for metrology, the laboratory was also asked to make specific measurements of the sample. In the first round of the study (representing 18 laboratories), data from 35 instruments from several manufacturers were obtained and the second round yielded information from 14 more instruments. The results of the analysis of the data obtained in this study are presented in this paper.