Search

The mechanism of the interaction of short-pulse laser radiation with glass and an immersion liquid in which a workpiece is immersed was investigated.

The results of the successful laser drilling of 30 – 200 μm in diameter microholes in glass ranging in thickness from 0.1 to 0.8 mm are reported. High-quality holes together with high process performance are achieved by using in the hole piercing process an immersion cooling liquid in contact with the bottom surface of the glass.

A new technology for laser cutting of glass along a curvilinear contour is described. This technology combines the use of two different methods of cutting in a single technological cycle: laser-controlled thermal splitting on rectilinear sections of the cutting contour and filamentation using a picosecond laser on curvilinear sections of the contour. The proposed technology makes it possible to significantly increase the productivity of the cutting process along curvilinear contours without compromising the strength characteristics of the glass products.

The results of calculations of thermal processes occurring in a bonded diamond tool during grinding of different materials on the surface in the contact zone with the machined material and in the interior of the diamond tool are presented. Amathematical model of the heating of the binder of the diamond tool as a result of friction in the grinding zone and cooling by a cutting liquid (CL) is described.

Examples are presented of the successful application of new types of diamond tools for high-efficiency processing of a wide class of materials such as glass, ceramic, sapphire, semiconductor materials, and different metals. The advantages of a bonded diamond tool based on heat-conducting polymer composite are shown.

Laser glass-welding technologies are reviewed. Welding technologies using continuous wave CO2-laser radiation in the surface-heating regime and in a deep melting regime are presented. A technology of microwelding of glass by lasers with ultra-short pulses and high pulse repetition frequency is examined.

In this study, elements of a new technology for the treatment of optoelectronic materials—laser plasma–chemical treatment—are investigated considering the splitting of diamond and sapphire wafers into crystals as an example. Copper vapor lasers and an ultraviolet laser with wavelengths of 510.6, 578.2, and 355 nm, respectively, are used in the experiments. The working pressure in the reactor is 1×10−3−1×10−1torr.

The results of a successful application of laser-controlled thermo-splitting (LCT) for precision cutting of glass, ceramic, and other brittle nonmetallic materials are presented. Other forms of the LCT method are examined: laser de-faceting, laser parallel thermo-splitting, and application of optical grids and rulings.

A new laser-blunting technology using thermal stresses to remove the sharp edges of articles made of glass and other brittle nonmetallic materials is described. A physical model is proposed for laser heating of the edges of a metallic material that is opaque to laser radiation. A relation is established between the main parameters of the process: facet size, defaceting speed, laser radiation intensity, and glass edge strength. The technological regimes are optimized; the technological process and laser equipment for cutting and defaceting glass are elaborated. The advantages of the new technology of laser blunting of glass edges over the conventional defaceting technology using a diamond-abrasive tool are shown.

The works on the partitioning of very hard semiconductor sapphire wafers with a diameter of 52 mm and thickness of 90 μm into monolithic integrated circuits (MICs) have been carried out using lasercontrolled thermal cleavage (LCT). The studies have been carried out and the works on cutting polycrystalline diamond wafers have been performed, as a result of which a method to partition the wafers into crystals, i.e., the laser plasmochemical method of cutting, is proposed, the basic advantage of which is the absence of the material bursting out from the cutting region and its deposition onto already formed device structures.

A mathematical model of the thermophysical processes that occur on the contact area between a heat-emitting element (a diamond grain) and the heat-dissipating (bonding) material is proposed for the grinding and polishing of optical materials using bonded diamond-abrasive tools. The results obtained illustrate the influence of the diamond grain size used in the bonded tool on the temperature field profile at the tool contact area and the correlation between the acceptable diamond grain size and the thermophysical properties of the binder material.

The results of mathematical and experimental modeling of the process of cross cutting float glass during the output process by means of laser controlled thermal cleaving (LCT) are presented. The calculations and confirming experimental results show that efficient length and cross cutting of a ribbon of float glass is possible by using a CO2 laser with power of the order of 500 W.

Studies were conducted to determine the strength and thermal stability of samples of glass with edges obtained by cutting a moving ribbon of float glass by mechanical and laser cutting. The advantage of laser cutting was demonstrated.