Search

Your search keyword '"Tung, Shih‐Huang"' showing total 318 results
Start Over Author "Tung, Shih‐Huang"
318 results on '"Tung, Shih‐Huang"'

7. Controlling the Thermoelectric Performance of Doped Naphthobisthiadiazole‐Based Donor–Acceptor Conjugated Polymers through Backbone Engineering.

Author

Ding, Jian‐Fa, Yamanaka, Kodai, Hong, Shao‐Huan, Chen, Guan‐Lin, Wu, Wei‐Ni, Lin, Jhih‐Min, Tung, Shih‐Huang, Osaka, Itaru, and Liu, Cheng‐Liang

Subjects
THERMOELECTRIC materials, SEEBECK coefficient, ELECTRIC conductivity, CARRIER density, CHARGE carrier mobility, CONJUGATED polymers
Abstract

This study investigates backbone engineering and evaluates the thermoelectric properties of FeCl3‐doped naphthobisthiadiazole (NTz)‐based donor–acceptor (D‐A) conjugated polymer films. The NTz acceptor unit is coupled with three distinct donor units, namely dialkylated terthiophene (3T), dialkylated quaterthiophene (4T), and dialkylated bisthienyl thienothiophene (2T‐TT) to yield copolymers designated as PNTz3T, PNTz4T, and PNTzTT. The difference in donor units leads to diverse molecule stacking and electronic properties, which can be systematically discovered via the three polymers. The linear structure of PNTz4T enables an orderly arrangement of side chains, thereby promoting dopant intercalation for enhanced carrier concentration. Additionally, this linear structure leads to an edge‐on stacking mode, thereby improving the in‐plane carrier mobility. As a result, the doped PNTz4T exhibits the highest electrical conductivity (σ) of 88.3 S cm−1 along with a Seebeck coefficient (S) of 62.2 µV K−1, thereby achieving the highest power factor (PF) of 34.2 µW m−1 K−2. These results highlight the relationship between the molecular design, microstructure, and doping effects in manipulating the thermoelectric performance of doped NTz‐based D‐A polymers. [ABSTRACT FROM AUTHOR]

Published
2024
Full Text
View/download PDF

24. Sustainable Super‐Insulating Packaging Composite from Recycled Wood.

Author

Liu, I‐Tseng, You, Jhu‐Lin, Tung, Shih‐Huang, and Liao, Ying‐Chih

Subjects
WOOD, PACKAGING materials, THERMAL insulation, FIREPROOFING, ENGINEERED wood, INSULATING materials
Abstract

Thermal insulation materials (TIMs) have been widely used over the past century. In this landscape, expandable polystyrene (EPS) is the dominant choice; however, the waste management of EPS is hampered by recycling challenges and lack of economic incentives. Concurrently, the order delivery and pharmaceutical distribution have experienced significant growth due to lifestyle shifts after the pandemic. For instance, the utilization of drones for transportation is illustrated (see abstract figure) as a prospective alternative transportation protocol. In this work, a synthetic method is developed to prepare bio‐degradable thermal insulator material from recycled wood and silica aerogel. The silica aerogel wood composite (SAWc) has the following properties: 1) low carbon emission (4.932 kg CO2e kg−1); 2) low thermal conductivity (0.032 W mK−1) with an anisotropy of 1.5; 3) high compressive strength (yield stress = 8.60 Mpa); 4) excellent resistance to organic solvents; 5) high biodegradability (49.4% weight loss after 28 days); 6) excellent flame retardancy, both of which are above EPS. The scalable, super‐insulating, and robust thermal insulator, as demonstrated in this work, holds high potential as an alternative packaging material poised to shape the next era in thermal insulation solutions. [ABSTRACT FROM AUTHOR]

Published
2024
Full Text
View/download PDF

37. Macroporous fibers electrospun from dual‐good solvent system.

Author

Chen, Fang‐Ting, Chang, Kai‐Pin, Liao, Yi‐Cheng, and Tung, Shih‐Huang

Subjects
SOLVENTS, ELECTROSPINNING, ADSORPTION capacity, PHASE separation, MACROPORES (Catalysis)
Abstract

The polymer/solvent/nonsolvent ternary solutions have been previously used for fabricating electrospun macroporous fibers, in which the nonsolvent was expected to induce a liquid–liquid phase separation that leads to formation of pores after drying. In this study, we demonstrate that the poly(styrene‐co‐acrylonitrile) (SAN)/chlorobenzene (CB)/dimethyl sulfoxide (DMSO) system can be successfully electrospun into highly uniform macroporous fibers with pore size >50 nm at CB/DMSO volume ratio ~7/3 though both CB and DMSO are good solvents to SAN. The results imply that a premixed nonsolvent is not necessary for the formation of macropores. We find that it is the water droplets condensed from the atmosphere that work as the nucleation sites to trigger the phase separation while water‐miscible DMSO plays a supporting role to expand the solvent‐rich phase and the resultant pore size. Instead of solvent quality, the distinct volatilities and water miscibilities of the solvents are the keys. The macropores throughout the fibers provide high surface areas and large openings on surface such that the fibers show a significant improvement in oil adsorption capacity in comparison to the smooth and mesoporous ones. [ABSTRACT FROM AUTHOR]

Published
2023
Full Text
View/download PDF

41. Heteroalkyl‐Substitution in Molecular Organic Semiconductors: Chalcogen Effect on Crystallography, Conformational Lock, and Charge Transport

Author

Afraj, Shakil N., primary, Lin, Chia‐Chi, additional, Velusamy, Arulmozhi, additional, Cho, Chang‐Hui, additional, Liu, Hsin‐Yi, additional, Chen, Jianhua, additional, Lee, Gene‐Hsiang, additional, Fu, Jui‐Chen, additional, Ni, Jen‐Shyang, additional, Tung, Shih‐Huang, additional, Yau, Shuehlin, additional, Liu, Cheng‐Liang, additional, Chen, Ming‐Chou, additional, and Facchetti, Antonio, additional

Published
2022
Full Text
View/download PDF

48. Solution Processable Pentafluorophenyl End‐Capped Dithienothiophene Organic Semiconductors for Hole‐Transporting Organic Field Effect Transistors

Author

Velusamy, Arulmozhi, primary, Yang, Yung‐Chi, additional, Lin, Chia‐Chi, additional, Afraj, Shakil N., additional, Jiang, Kexing, additional, Chen, Peng‐Sheng, additional, Yau, Shueh‐Lin, additional, Osaka, Itaru, additional, Tung, Shih‐Huang, additional, Chen, Ming‐Chou, additional, and Liu, Cheng‐Liang, additional

Published
2021
Full Text
View/download PDF

Catalog

Books, media, physical & digital resources
See catalog results