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Atmospheric plasma etching (APE) has been used to texture Si surfaces due to anisotropic material removal capability. Controlling features and size of the light-trapping structure are keys to improving the reflection performance of silicon (Si) solar cells, which need to fully understand the interfacial etching behavior and the microscopic topography formation mechanism of the Si surface. In this study, microwave plasma with a temperature below 100 °C is employed to investigate the dependence of microstructure evolution on the O/F atom ratios in plasma. The results show that as the O/F atom ratios increase, the microstructure of the Si surface changes from square opening pits to spherical opening pits. High-resolution transmission electron microscopy and x-ray photoelectron spectroscopy analyses indicate that the exciting F atoms dominate the orientation-selective etching process, causing the formation of square opening pits. The CFx and C2 radicals induce the generation of the Si interface reactive layer, resulting in the occurrence of amorphous layers and termination of the non ⟨111⟩-crystal face in APE. The exciting O atoms preferentially occupy the active site of Si surfaces, causing the isotropic etching and then the formation of spherical opening pits. In addition, the richer O atoms will weaken the anisotropic etching ability of F atoms, resulting in the etched surface trends' flattening. The insight into anisotropic etching behavior and topography formation mechanism of the silicon surface textured by atmospheric plasma is valuable for developing a new texturing approach to silicon solar cells. [ABSTRACT FROM AUTHOR]

Applying atmospheric plasma etching to the surface texturing process of silicon solar cells is a promising strategy for the current photovoltaic manufacturing industry due to its low equipment cost and good fabrication flexibility. This paper investigates the morphology evolution of the silicon surface etched by an Ar/CF4/O2 plasma and the associated optical properties. Results show that the generation of the light trapping structure on the polished silicon surface can be divided into two stages on the basis of the multi-scale morphological images and the quantitative evaluation of roughness parameters. The initial roughening stage mainly involves the formation of high-frequency nanoroughness that can act as an effective medium layer with a gradual refractive index. The resulting optical medium effect can reduce the surface reflectance within a broad range of wavelengths. At the next texturing stage, the low-frequency and high-amplitude microroughness dominates the morphology of the etched silicon surface. It features inverted parabolic structures with a high aspect ratio, which can cause multiple reflections of the incident light. The optical medium effect resulting from the nanoroughness is also inherited. Thus, the anti-reflectance property of the etched silicon surface is greatly improved. This work demonstrates that the light trapping properties of silicon surface etched by atmospheric plasma jet are a synergy of the optical medium effect and geometrical optics. Insights into the morphology evolution and optical properties of the textured surfaces are important for developing a new surface texturing process of silicon solar cells. [ABSTRACT FROM AUTHOR]