14 results on '"Tao, Q.B."'
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2. A data-driven approach based on long short-term memory and hidden Markov model for crack propagation prediction
3. Isothermal aging and shear creep behavior of a novel lead-free solder joint with small additions of Bi, Sb and Ni
4. Viscoplastic characterization and post-rupture microanalysis of a novel lead-free solder with small additions of Bi, Sb and Ni
5. Micromechanical model for describing intergranular fatigue cracking in a lead-free solder alloy
6. Development and First Assessment of a DIC System for a Micro-Tensile Tester Used for Solder Characterization
7. Temperature‐dependent fatigue modelling of a novel Ni, Bi and Sb containing Sn‐3.8Ag‐0.7Cu lead‐free solder alloy
8. Study of Surface Roughness of Electronic Substrate on Abrasive Belt Grinding
9. A Digital Image Correlation setup for the analysis of lead-free solder alloys
10. Effect of Ni and Sb additions and testing conditions on the mechanical properties and microstructures of lead-free solder joints
11. Zn-doped Zr oxynitride as charge-trapping layer for flash memory applications
12. Improved performance of GeON as charge storage layer in flash memory by optimal annealing
13. Varying sputtering ambient and annealing gas to optimize the electrical properties of MOS capacitor with HfLaO gate dielectric.
14. Improved performance of low-voltage pentacene OTFTs by Incorporating La to Hafinium Oxide Gate dielectric.
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