25 results on '"Takanori Shuto"'
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2. System Reduction Method Using Spectrum of Power Oscillation Waveform
3. A Study on Power System Control Considering Both Transient Stability and Voltage Stability
4. Fabrication of VGA size near-infrared image sensor using room-temperature flip-chip bonding technology
5. Room-temperature vacuum packaging using ultrasonic bonding with Cu compliant rim
6. In-situ observation of ultrasonic bonding using high speed camera
7. Analysis of room-temperature bonded compliant bump with ultrasonic bonding
8. An Improved Method to Approximate Closest Saddle Node Bifurcation Based on Multiple Load Flow Solutions
9. A Distributed Autonomous Control Method for TCUL Transformers Using a Fuzzy Adaptive Control Scheme
10. Room-temperature high-density interconnection using ultrasonic bonding of cone bump for heterogeneous integration
11. Room Temperature Bonding of Heterogeneous Materials for Near-Infrared Image Sensor
12. Room temperature microjoining of qVGA class area-bump array using cone bump
13. Room-temperature microjoining using ultrasonic bonding of compliant bump
14. Low-temperature bonding of LSI chips to PEN film using Au cone bump for heterogeneous integration
15. Room-Temperature Bonding of LSI Chips on PEN Film Using Mechanical Caulking of Au Cone Bump
16. Low-temperature bonding of LSI chips to polymer substrate using Au cone bump for flexible electronics
17. Conductive polymer/metal composites for interconnect of flexible devices
18. In situ observation of ultrasonic flip-chip bonding using high-speed camera
19. Room-temperature hermetic sealing by ultrasonic bonding with Au compliant rim
20. Room-temperature bonding of heterogeneous materials for near-infrared image sensor
21. Ultrasonic Bonding of Cone Bump for Integration of Large-Scale Integrated Circuits in Flexible Electronics
22. Room-Temperature Microjoining of LSI Chips on Poly(ethylene naphthalate) Film Using Mechanical Caulking of Au Cone Bump
23. Microjoining of LSI Chips on Poly(ethylene naphthalate) Using Compliant Bump
24. Conductive polymer/metal composites for interconnect of flexible devices.
25. Room-temperature hermetic sealing by ultrasonic bonding with Au compliant rim.
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