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We present the design, implementation, and characterization of compact on-package integrated multilayer image-reject filters. The filter implemented in a novel lumped-element stripline configuration in a standard low-temperature cofired ceramic technology occupies an area of only 3.8 mm x 2.4 mm x 0.5 mm. A distinct feature of this filter is the optimal use of the parasitics of the lumped-element components to implement other components as an integral part of the filter by novel vertical deployments of planar structures. Measurement data of the prototype indicate 3 dB of insertion loss and 20 dB of return loss at the center frequency of 2.4 GHz, as well as 39-dB attenuation at the image frequency, suitable for Bluetooth applications. This paper demonstrates the feasibility of on-package integration of RF front-end elements where the transceiver module is built and, therefore, significantly reduces the development cost. Index Terms--Bandpass filter, Bluetooth, image-reject filter, low-temperature cofired ceramic (LTCC), lumped-element filter, system-on-package.

In this paper, we present the development and full characterization and modeling of a multilayer ceramic-based system-on-package component library. Compact high-Q three-dimensional inductor and capacitor topologies have been chosen and incorporated. A measured inductor Q factor as high as 100 and self-resonant frequency as high as 8 GHz have been demonstrated. The new vertically interdigitated capacitor topology occupies nearly an order of magnitude less of real estate while demonstrating comparable performance to the conventional topology. The low-temperature co-fired ceramic (LTCC) library has been incorporated into a 1.9-GHz CMOS power-amplifier design exhibiting a measured 17-dB gain, 26-dBm output power, and 48% power added efficiency. This power-amplifier module with fully integrated LTCC passives demonstrates a superior performance to those with full and partial on-chip passive integration. Index Terms--CMOS, high-Q inductors, LTCC, passive library, power amplifier.

Presents a study that examined the design, implementation and measurement of a three-dimensional-deployed radio frequency front-end system-on-package in a standard multi-layer low temperature co-fired ceramic (LTCC) technology. Background on the system design consideration; Investigation of the millimeter-wave integrated circuits design and measured performance; Analysis of the LTCC-based module design and measured performance.

Presents the design, model, and measurement data of a radio frequency microwave multilayer transitions and integrated passives implemented in a multilayer organic system on package (SOP) technology. Discussion on the SOP technology; Definition of a multi-layer organic packaging; Role of embedded filters in wireless module applications.

Presents the first comprehensive experimental characterization of bond wire interconnects at microwave frequencies which includes a repeatability study, modeling and optimization. Comparison of ball-crescent and wedge wire bonds; Discussion of the electromagnetic and lumped element electrical model; Analysis of bond wire interconnects.

Presents a method for the development of a model for microwave flip chip technology. Characterization and modeling of flip chip packages to microwave frequencies; Measurements of test structures and simulations to generate circuit models; Presentation of an approach to scaling the elements of a flip chip transition.

Describes the development and design of multilayer plastic-based multichip modules (MCM) at microwave frequencies. Details of the plastic MCM technology; Development of vertical feed-through transports using a coplanar waveguide configuration; Demonstration of packaged microwave multilayer integrated circuits using plastic MCM.

Provides information on a study which demonstrated the feasibility of using low-temperature co-fired ceramic as an RF/microwave packaging solution with multilayer interconnects and embedded passives. Experimental details.