1. Low Current Density Cathode Plasma Electrolytic Deposition of Aluminum Alloy Based on a Bipolar Pulse Power Supply.
- Author
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Li, Hang, Zhao, Guochen, Yu, Huan, Cheng, Kaiming, Feng, Xuansheng, Liu, Yunteng, Zhou, Jixue, Bai, Minghua, Ni, Fengyao, Wu, Jinkui, and Sun, Zhizhuang
- Subjects
CERAMIC coating ,PROTECTIVE coatings ,SURFACE preparation ,COMPOSITE coating ,ALUMINUM alloys - Abstract
The present paper reported a novel bipolar-pulse cathodic plasma electrolytic deposition (BP-CPED) technique with a low current density. This newly developed CPED technique can break down the barriers of the existing CPED technique with higher current density. In this report, ceramic coatings were successfully prepared on aluminum alloy via the BP-CPED technique in an aqueous carbamide-based electrolyte. Data recording results in the reacting process show that there is the current density of the cathode below 0.15 A/cm
2 and that of the anode below 0.035 A/cm2 , which approximately reaches the level of conventional MAO technique. Interestingly, the addition of PEG into the electrolyte can further reduce the current density and effectively improve the coating quality. The kinetic of the BP-CPED process was discussed based on the evolution of current density/voltage-time curves and spark discharge phenomena. SEM observations illustrate that BP-CPED coatings possess a typical porous-surface feature. XRD analysis indicates that the coating was mainly composed of Al2 O3 and Al4 C3 . Al2 O3 /Al4 C3 /ZrO2 composite coatings fabricated after Zr-doping reflected the successful Zr-incorporation into the coating, which demonstrated that the BP-CPED technique can be used to design the coating composition by the doping modification. The direct pull-off and thermal shock tests confirmed that new BP-CPED coatings obtained under the cathodic plasma discharge have excellent bonding strength. It is possible that this novel BP-CPED technique can provide a promising choice in developing the large-area CPED surface treatment for the industrial application. [ABSTRACT FROM AUTHOR]- Published
- 2024
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