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188 results on '"Sun, Gaohui"'

29. Facile construction of porous epoxy resin/geopolymer composites using red mud and slag by well‐distributed dual‐blending.

Author

Bai, Chengying, Zheng, Kankan, Wang, Bin, Li, Bozhi, Sun, Gaohui, Li, Xinyu, Wang, Xiaodong, Qiao, Yingjie, and Colombo, Paolo

Subjects
EPOXY resins, THERMAL conductivity, THERMAL insulation, RAW materials, SOLID waste
Abstract

Porous geopolymer composite (E51) reinforced by E51 epoxy resin was prepared by well‐distributed dual‐blending using red mud, metakaolin, and slag as raw materials. The effects of E51 content on microstructure, porosity, mechanical properties, and thermal insulation properties of the porous composites were investigated. The addition of E51 changed the setting time and viscosity of the slurry with high content of solid wastes (80%), which play an important role in the formation of pores during the direct foaming process. The addition of E51 had great influence on the porous properties of geopolymer composites, which in turn affected their compressive strength (0.19–1.44 MPa) and thermal conductivity (0.09–0.12 W/mK). The addition of E51 enabled the production of geopolymer composites in a rather large range of total porosity (67.3–81.1 vol%), with an optimal sample possessing a total porosity of up to 78.7 vol%, a thermal conductivity of 0.086 W/mK, and a compression strength of 0.47 MPa. [ABSTRACT FROM AUTHOR]

Published
2024
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33. A Novel Hydrophobic Polyimide Film with Sag Structure Derived from Multi‐Hybrid Strategy.

Author

Tao, Kangkang, Sun, Gaohui, Zhang, Shuai, Wang, Jun, Chen, Rongrong, and Han, Shihui

Subjects
*POLYIMIDE films, *POLYIMIDES, *MICROELECTRONIC packaging, *CONTACT angle, *INTEGRATED circuits, *LEAD dioxide
Abstract

Polyimide (PI) film with hydrophilic greatly limits their application in the field of microelectronic device packaging. A novel hydrophobic PI film with sag structure and improved mechanical properties is prepared relying on the reaction between anhydride‐terminated isocyanate‐based polyimide (PIY) containing a seven‐membered ring structure and the amino‐terminated polyamide acid (PAA) via multi‐hybrid strategy, this work named it as hybrid PI film and marked it as PI‐PIY‐X. PI‐PIY‐30 showed excellent hydrophobic properties, and the water contact angle could reach to 102°, which is 20% and 55% higher than simply PI film and PIY film, respectively. The water absorption is only 1.02%, with a decrease of 49% and 53% compared with PI and PIY. Due to that the degradation of seven‐membered ring and generation of carbon dioxide led to the formation of sag structure, the size of sag structures is ≈16.84 and 534.55 nm for in‐plane and out‐plane direction, which are observed on surface of PI‐PIY‐30. Meanwhile, PI‐PIY‐30 possessed improved mechanical properties, and the tensile strength is 109.08 MPa, with 5% and more than 56% higher than that of pure PI and PIY film, showing greatly application prospects in the field of integrated circuit. [ABSTRACT FROM AUTHOR]

Published
2024
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