163 results on '"Sukharev, Valeriy"'
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2. Warpage Study by Employing an Advanced Simulation Methodology for Assessing Chip Package Interaction Effects
3. Physics-based simulation of stress-induced and electromigration-induced voiding and their interactions in on-chip interconnects
4. Dynamic electromigration modeling for transient stress evolution and recovery under time-dependent current and temperature stressing
5. Electromigration Assessment in Power Grids with Account of Redundancy and Non-Uniform Temperature Distribution
6. Studying the Impact of Temperature Gradient on Electromigration Lifetime Using a Power Grid Test Structure with On-Chip Heaters
7. Electromigration assessment for power grid networks considering temperature and thermal stress effects
8. Experimental Validation of a Novel Methodology for Electromigration Assessment in On-Chip Power Grids
9. (Invited, Digital Presentation) Advanced Methodology for Assessing Chip Package Interaction Induced Stress Effects on Chip Performance and Reliability
10. Beyond Black’s equation: Full-chip EM/SM assessment in 3D IC stack
11. Novel Methodology for Assessing Chip-Package Interaction Effects onChip Performance
12. 3-D Physically-Based Electromigration Simulation in Copper - Low-K Interconnect
13. Multi-scale Simulation Methodology for Stress Assessment in 3D IC: Effect of Die Stacking on Device Performance
14. Novel physics-based tool-prototype for electromigration assessment in commercial-grade power delivery networks
15. Physically based simulation of electromigration-induced degradation mechanisms in dual-inlaid copper interconnects
16. Electromigration checking using a stochastic effective current model
17. Electromigration simulation and design considerations for integrated circuit power grids
18. Advanced methodology for assessing chip package interaction effects on chip performance and reliability after chip assembly and during chip operation
19. Power Grid Fixing for Electromigration-induced Voltage Failures
20. An Accurate Assessment of Chip-Package Interaction is a Key Factor for Designing Resilient 3D IC Systems
21. Effect of interface strength on electromigration-induced inlaid copper interconnect degradation: Experiment and simulation
22. Efficient Simulation of Electromigration Damage in Large Chip Power Grids Using Accurate Physical Models (Invited Paper)
23. Electromigration Check: Where the Design and Reliability Methodologies Meet
24. Guest Editorial for IRSP 2018 Conference
25. Power Grid Electromigration Checking Using Physics-Based Models
26. Analysis of the Effect of TSV-Induced Stress on Devices Performance by Direct Strain and Electrical Measurements and FEA Simulations
27. Fast physics-based electromigration assessment by efficient solution of linear time-invariant (LTI) systems
28. A model for electromigration-induced degradation mechanisms in dual-inlaid copper interconnects: Effect of microstructure.
29. A model for electromigration-induced degradation mechanisms in dual-inlaid copper interconnects: Effect of interface bonding strength.
30. Finite-difference methodology for full-chip electromigration analysis applied to 3D IC test structure: Simulation vs. experiment
31. Carrier Mobility Shift in Advanced Silicon Nodes Due to Chip-Package Interaction
32. Theoretical predictions of EM-induced degradation in test-structures and on-chip power grids with analytical and numerical analysis
33. CPI Stress Induced Carrier Mobility Shift in Advanced Silicon Nodes
34. Fast physics-based electromigration checking for on-die power grids
35. Analytical Modeling and Characterization of Electromigration Effects for Multibranch Interconnect Trees
36. Physics-Based Electromigration Models and Full-Chip Assessment for Power Grid Networks
37. Physics-based full-chip TDDB assessment for BEOL interconnects
38. Novel approaches to determine thermomechanical materials data in advanced interconnect stacks
39. Postvoiding Stress Evolution in Confined Metal Lines
40. Learning-Based Dynamic Reliability Management For Dark Silicon Processor Considering EM Effects
41. Electromigration recovery modeling and analysis under time-dependent current and temperature stressing
42. Multiscale Transient Thermal Analysis of Microelectronics
43. Post placement leakage reduction with stress-enhanced filler cells
44. Interconnect reliability modeling and analysis for multi-branch interconnect trees
45. Lifetime optimization for real-time embedded systems considering electromigration effects
46. IR-drop based electromigration assessment: Parametric failure chip-scale analysis
47. Physics-Based Full-Chip TDDB Assessment for BEOL Interconnects.
48. Learning-based dynamic reliability management for dark silicon processor considering EM effects.
49. Electromigration analysis of full-chip integrated circuits with hydrostatic stress
50. Physics-based Electromigration Assessment for Power Grid Networks
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