1. Non-epitaxial growth of highly oriented transition metal dichalcogenides with density-controlled twin boundaries
- Author
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Juntong Zhu, Zhili Hu, Shasha Guo, Ruichun Luo, Maolin Yu, Ang Li, Jingbo Pang, Minmin Xue, Stephen J. Pennycook, Zheng Liu, Zhuhua Zhang, and Wu Zhou
- Subjects
Science (General) ,Q1-390 - Abstract
Twin boundaries (TBs) in transition metal dichalcogenides (TMDs) constitute distinctive one-dimensional electronic systems, exhibiting intriguing physical and chemical properties that have garnered significant attention in the fields of quantum physics and electrocatalysis. However, the controlled manipulation of TBs in terms of density and specific atomic configurations remains a formidable challenge. In this study, we present a non-epitaxial growth approach that enables the controlled and large-scale fabrication of homogeneous catalytically active TBs in monolayer TMDs on arbitrary substrates. Notably, the density achieved using this strategy is six times higher than that observed in convention chemical vapor deposition (CVD)-grown samples. Through rigorous experimental analysis and multigrain Wulff construction simulations, we elucidate the role of regulating the metal source diffusion process, which serves as the key factor for inducing the self-oriented growth of TMD grains and the formation of unified TBs. Furthermore, we demonstrate that this novel growth mode can be readily incorporated into the conventional CVD growth method by making a simple modification of the growth temperature profile, thereby offering a universal approach for engineering of grain boundaries in two-dimensional materials. Public summary: • Differences in diffusivity of metal sources trigger the non-epitaxial growth of twin boundaries. • The growth mechanism of high-density 1D twin boundaries on arbitrary substrates is revealed. • A possible universal strategy for grain boundary engineering in 2D materials is proposed. • Density-controllable twin boundaries provide a promising platform for exploring novel quantum states in 1D electronic systems.
- Published
- 2023
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