1. Improved Mounting of Strain Sensors by Reactive Bonding
- Author
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Stefan Steckemetz, Vraj Shah, Stephan Knappmann, Andreas Leson, Alfons Dehe, Axel Schumacher, Thorsten Hehn, Erik Pflug, Georg Dietrich, and Publica
- Subjects
sensor mounting ,Materials science ,Adhesive bonding ,strain sensor ,joining ,Mechanical Engineering ,reactive bonding ,reactive multilayers ,semiconductors ,semiconductor ,Chip ,Piezoresistive effect ,Article ,Reactive bonding ,Mechanics of Materials ,Soldering ,Ultimate tensile strength ,Coupling (piping) ,General Materials Science ,Composite material ,nanomaterials ,Tensile testing - Abstract
Aim of this work is to improve the bond between a strain sensor and a device on which the strain shall be determined. As strain sensor, a CMOS-integrated chip featuring piezoresistive sensor elements was used which is capable of wireless energy and data transmission. The sensor chip was mounted on a standardized tensile test specimen of stainless steel by a bonding process using reactive multilayer systems (RMS). RMS provide a well-defined amount of heat within a very short reaction time of a few milliseconds and are placed in-between two bonding partners. RMS were combined with layers of solder which melt during the bonding process. Epoxy adhesive films were used as a reference bonding process. Under mechanical tensile loading, the sensor bonded with RMS shows a linear strain sensitivity in the whole range of tested forces whereas the adhesive-bonded sensor has slightly nonlinear behavior for low forces. Compared to the adhesive-bonded chips, the sensitivity of the reactively bonded chips is increased by a factor of about 2.5. This indicates a stronger mechanical coupling by reactive bonding as compared to adhesive bonding.
- Published
- 2021