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Developing materials for electronics and sensing based on abundant and degradable materials is fundamental for transitioning both fields toward a more sustainable future. In the long run, this approach can unleash these fields from using petroleum‐derived and/or scarce resources, possibly facilitating electronic waste (e‐waste) management at the same time. Starch, one of the most abundant and versatile natural polymers, has shown great potential in the fabrication of degradable/transient devices. In this work, electrically conductive and mechanically robust starch‐Ti3C2Tx MXene nanocomposites are successfully engineered, offering a promising advancement in sustainable electronics. The nanocomposite films exhibit remarkable tunability with varying MXene concentrations (from 0.69 to 2.42 vol%), allowing precise control over their properties. This tunability enables modifications in tensile strength (from 6.4 to 11.2 MPa), electrical conductivity (from 2.31 × 10−3 to 3.98 S m−1), and gauge factor. Such characteristics make these films ideal for various applications, including body movement monitoring, tactile sensing, handwriting recognition, and electronic smart skin. Unlike their petroleum‐based counterparts, the starch‐based films demonstrate significant biodegradability, breaking down within a month after being buried in soil. This rapid degradation highlights the potential of these transient composites for various electronics applications, offering an environmentally friendly alternative. [ABSTRACT FROM AUTHOR]

Herein we present the transformative effects of multiwall carbon nanotube (MWCNT)-MXene hybrid nanofillers on the mechanical, electrical, and piezoresistive properties of the resulting epoxy nanocomposites. The utilization of the MWCNT-MXene hybrids significantly improves the dispersion of fillers within the epoxy matrix, effectively eliminating the agglomeration of individual fillers and improving the stress transfer efficiency. With just 1 wt % MWCNT-MXene hybrid, we observed improvements in the Young's modulus and the flexural modulus, which increased by 31 and 28%, respectively, when compared to neat epoxy. Furthermore, the fracture toughness of these composites was 84.5% higher than that of neat epoxy, primarily attributed to crack deflection and filler debonding mechanisms. The hybrid composites exhibited increased piezoresistive sensitivity during tensile, flexural, and fracture tests due to the creation of a percolating network of MWCNT and MXene nanoplatelets. Our findings have implications for the development of advanced hybrid materials, holding promise for applications in strain sensors and self-sensing structures. [ABSTRACT FROM AUTHOR]